JPS53138056A - Method of coating resin layer on printed circuit board metal material substrate having through hole - Google Patents

Method of coating resin layer on printed circuit board metal material substrate having through hole

Info

Publication number
JPS53138056A
JPS53138056A JP1854177A JP1854177A JPS53138056A JP S53138056 A JPS53138056 A JP S53138056A JP 1854177 A JP1854177 A JP 1854177A JP 1854177 A JP1854177 A JP 1854177A JP S53138056 A JPS53138056 A JP S53138056A
Authority
JP
Japan
Prior art keywords
hole
circuit board
printed circuit
resin layer
metal material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1854177A
Other languages
English (en)
Other versions
JPS5814759B2 (ja
Inventor
Kouji Sasanami
Yoshikatsu Saitou
Hitoshi Aizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Nippon Telegraph and Telephone Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP52018541A priority Critical patent/JPS5814759B2/ja
Publication of JPS53138056A publication Critical patent/JPS53138056A/ja
Publication of JPS5814759B2 publication Critical patent/JPS5814759B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP52018541A 1977-02-22 1977-02-22 スルホ−ルを有す印刷配線板用金属材料基板へ樹脂層を塗布形成させる方法 Expired JPS5814759B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52018541A JPS5814759B2 (ja) 1977-02-22 1977-02-22 スルホ−ルを有す印刷配線板用金属材料基板へ樹脂層を塗布形成させる方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52018541A JPS5814759B2 (ja) 1977-02-22 1977-02-22 スルホ−ルを有す印刷配線板用金属材料基板へ樹脂層を塗布形成させる方法

Publications (2)

Publication Number Publication Date
JPS53138056A true JPS53138056A (en) 1978-12-02
JPS5814759B2 JPS5814759B2 (ja) 1983-03-22

Family

ID=11974480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52018541A Expired JPS5814759B2 (ja) 1977-02-22 1977-02-22 スルホ−ルを有す印刷配線板用金属材料基板へ樹脂層を塗布形成させる方法

Country Status (1)

Country Link
JP (1) JPS5814759B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936992A (ja) * 1982-08-25 1984-02-29 松下電器産業株式会社 金属ベ−スプリント基板
JPS59180461U (ja) * 1983-05-18 1984-12-01 株式会社三協精機製作所 絶縁金属配線基板
JP2009170500A (ja) * 2008-01-11 2009-07-30 Fujitsu Ltd プリント配線板の作製方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286157A (en) * 1976-01-14 1977-07-18 Citizen Watch Co Ltd Method of producing circuit substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286157A (en) * 1976-01-14 1977-07-18 Citizen Watch Co Ltd Method of producing circuit substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936992A (ja) * 1982-08-25 1984-02-29 松下電器産業株式会社 金属ベ−スプリント基板
JPH0355993B2 (ja) * 1982-08-25 1991-08-27
JPS59180461U (ja) * 1983-05-18 1984-12-01 株式会社三協精機製作所 絶縁金属配線基板
JP2009170500A (ja) * 2008-01-11 2009-07-30 Fujitsu Ltd プリント配線板の作製方法

Also Published As

Publication number Publication date
JPS5814759B2 (ja) 1983-03-22

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