JPS53128275A - Semiconductor packaging lead frame and method of producing same and mask plate for producing same - Google Patents

Semiconductor packaging lead frame and method of producing same and mask plate for producing same

Info

Publication number
JPS53128275A
JPS53128275A JP4251677A JP4251677A JPS53128275A JP S53128275 A JPS53128275 A JP S53128275A JP 4251677 A JP4251677 A JP 4251677A JP 4251677 A JP4251677 A JP 4251677A JP S53128275 A JPS53128275 A JP S53128275A
Authority
JP
Japan
Prior art keywords
producing same
lead frame
mask plate
semiconductor packaging
packaging lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4251677A
Other languages
English (en)
Other versions
JPS617030B2 (ja
Inventor
Takeshi Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP4251677A priority Critical patent/JPS53128275A/ja
Publication of JPS53128275A publication Critical patent/JPS53128275A/ja
Publication of JPS617030B2 publication Critical patent/JPS617030B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4251677A 1977-04-15 1977-04-15 Semiconductor packaging lead frame and method of producing same and mask plate for producing same Granted JPS53128275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4251677A JPS53128275A (en) 1977-04-15 1977-04-15 Semiconductor packaging lead frame and method of producing same and mask plate for producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4251677A JPS53128275A (en) 1977-04-15 1977-04-15 Semiconductor packaging lead frame and method of producing same and mask plate for producing same

Publications (2)

Publication Number Publication Date
JPS53128275A true JPS53128275A (en) 1978-11-09
JPS617030B2 JPS617030B2 (ja) 1986-03-03

Family

ID=12638227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4251677A Granted JPS53128275A (en) 1977-04-15 1977-04-15 Semiconductor packaging lead frame and method of producing same and mask plate for producing same

Country Status (1)

Country Link
JP (1) JPS53128275A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587843A (ja) * 1981-07-07 1983-01-17 Nec Corp リ−ドフレ−ムの製造方法
JPS6052050A (ja) * 1983-08-31 1985-03-23 Dainippon Printing Co Ltd リ−ドフレ−ムの製造方法
JPS60240148A (ja) * 1984-05-15 1985-11-29 Toppan Printing Co Ltd リ−ドフレ−ムの製造方法
JPH0218955A (ja) * 1988-07-07 1990-01-23 Mitsui High Tec Inc 半導体装置用リードフレーム
JP5158279B1 (ja) * 2012-06-13 2013-03-06 富士ゼロックス株式会社 金属板の製造方法、金属発熱体

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587843A (ja) * 1981-07-07 1983-01-17 Nec Corp リ−ドフレ−ムの製造方法
JPS6052050A (ja) * 1983-08-31 1985-03-23 Dainippon Printing Co Ltd リ−ドフレ−ムの製造方法
JPS60240148A (ja) * 1984-05-15 1985-11-29 Toppan Printing Co Ltd リ−ドフレ−ムの製造方法
JPH0218955A (ja) * 1988-07-07 1990-01-23 Mitsui High Tec Inc 半導体装置用リードフレーム
JP5158279B1 (ja) * 2012-06-13 2013-03-06 富士ゼロックス株式会社 金属板の製造方法、金属発熱体

Also Published As

Publication number Publication date
JPS617030B2 (ja) 1986-03-03

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