JPS53117966A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS53117966A JPS53117966A JP3213377A JP3213377A JPS53117966A JP S53117966 A JPS53117966 A JP S53117966A JP 3213377 A JP3213377 A JP 3213377A JP 3213377 A JP3213377 A JP 3213377A JP S53117966 A JPS53117966 A JP S53117966A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- elements
- interposing
- breakdown
- eliminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3213377A JPS53117966A (en) | 1977-03-25 | 1977-03-25 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3213377A JPS53117966A (en) | 1977-03-25 | 1977-03-25 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53117966A true JPS53117966A (en) | 1978-10-14 |
Family
ID=12350386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3213377A Pending JPS53117966A (en) | 1977-03-25 | 1977-03-25 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53117966A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63208227A (ja) * | 1987-02-25 | 1988-08-29 | Hitachi Ltd | 半導体装置 |
US6614105B2 (en) * | 2000-02-29 | 2003-09-02 | Powered Co., Ltd. | Chip-type semiconductor device |
-
1977
- 1977-03-25 JP JP3213377A patent/JPS53117966A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63208227A (ja) * | 1987-02-25 | 1988-08-29 | Hitachi Ltd | 半導体装置 |
US6614105B2 (en) * | 2000-02-29 | 2003-09-02 | Powered Co., Ltd. | Chip-type semiconductor device |
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