JPS53116087A - Manufacture for multilayer wiring - Google Patents
Manufacture for multilayer wiringInfo
- Publication number
- JPS53116087A JPS53116087A JP3031977A JP3031977A JPS53116087A JP S53116087 A JPS53116087 A JP S53116087A JP 3031977 A JP3031977 A JP 3031977A JP 3031977 A JP3031977 A JP 3031977A JP S53116087 A JPS53116087 A JP S53116087A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- multilayer wiring
- manufacture
- layers
- aboid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Abstract
PURPOSE:To aboid the short circuit between the wiring layers and to increase the reliability of multilayer wiring, by converting the stepping part of the lower Al wiring into Al2O3 with anode oxidation method, and by forming the upper layer Al wiring on it via the insulating film between layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3031977A JPS53116087A (en) | 1977-03-22 | 1977-03-22 | Manufacture for multilayer wiring |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3031977A JPS53116087A (en) | 1977-03-22 | 1977-03-22 | Manufacture for multilayer wiring |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53116087A true JPS53116087A (en) | 1978-10-11 |
Family
ID=12300467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3031977A Pending JPS53116087A (en) | 1977-03-22 | 1977-03-22 | Manufacture for multilayer wiring |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53116087A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157272A (en) * | 1978-05-31 | 1979-12-12 | Siemens Ag | Method of producing conductive path laminated crossing |
JPS5615052A (en) * | 1979-07-18 | 1981-02-13 | Hitachi Ltd | Semiconductor device with multilayer wiring |
WO2014102881A1 (en) * | 2012-12-28 | 2014-07-03 | 国立大学法人東北大学 | Semiconductor device, mis transistor, and multilayer wiring substrate |
JPWO2014102880A1 (en) * | 2012-12-28 | 2017-01-12 | 国立大学法人東北大学 | Multilayer wiring board |
US10327799B2 (en) | 2014-09-30 | 2019-06-25 | Imott Inc. | Scissors |
-
1977
- 1977-03-22 JP JP3031977A patent/JPS53116087A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157272A (en) * | 1978-05-31 | 1979-12-12 | Siemens Ag | Method of producing conductive path laminated crossing |
JPS5615052A (en) * | 1979-07-18 | 1981-02-13 | Hitachi Ltd | Semiconductor device with multilayer wiring |
WO2014102881A1 (en) * | 2012-12-28 | 2014-07-03 | 国立大学法人東北大学 | Semiconductor device, mis transistor, and multilayer wiring substrate |
JPWO2014102880A1 (en) * | 2012-12-28 | 2017-01-12 | 国立大学法人東北大学 | Multilayer wiring board |
JPWO2014102881A1 (en) * | 2012-12-28 | 2017-01-12 | 国立大学法人東北大学 | Multilayer wiring board |
US10327799B2 (en) | 2014-09-30 | 2019-06-25 | Imott Inc. | Scissors |
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