JPS53116087A - Manufacture for multilayer wiring - Google Patents

Manufacture for multilayer wiring

Info

Publication number
JPS53116087A
JPS53116087A JP3031977A JP3031977A JPS53116087A JP S53116087 A JPS53116087 A JP S53116087A JP 3031977 A JP3031977 A JP 3031977A JP 3031977 A JP3031977 A JP 3031977A JP S53116087 A JPS53116087 A JP S53116087A
Authority
JP
Japan
Prior art keywords
wiring
multilayer wiring
manufacture
layers
aboid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3031977A
Other languages
Japanese (ja)
Inventor
Takeo Kamiyama
Hideaki Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3031977A priority Critical patent/JPS53116087A/en
Publication of JPS53116087A publication Critical patent/JPS53116087A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)

Abstract

PURPOSE:To aboid the short circuit between the wiring layers and to increase the reliability of multilayer wiring, by converting the stepping part of the lower Al wiring into Al2O3 with anode oxidation method, and by forming the upper layer Al wiring on it via the insulating film between layers.
JP3031977A 1977-03-22 1977-03-22 Manufacture for multilayer wiring Pending JPS53116087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3031977A JPS53116087A (en) 1977-03-22 1977-03-22 Manufacture for multilayer wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3031977A JPS53116087A (en) 1977-03-22 1977-03-22 Manufacture for multilayer wiring

Publications (1)

Publication Number Publication Date
JPS53116087A true JPS53116087A (en) 1978-10-11

Family

ID=12300467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3031977A Pending JPS53116087A (en) 1977-03-22 1977-03-22 Manufacture for multilayer wiring

Country Status (1)

Country Link
JP (1) JPS53116087A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54157272A (en) * 1978-05-31 1979-12-12 Siemens Ag Method of producing conductive path laminated crossing
JPS5615052A (en) * 1979-07-18 1981-02-13 Hitachi Ltd Semiconductor device with multilayer wiring
WO2014102881A1 (en) * 2012-12-28 2014-07-03 国立大学法人東北大学 Semiconductor device, mis transistor, and multilayer wiring substrate
JPWO2014102880A1 (en) * 2012-12-28 2017-01-12 国立大学法人東北大学 Multilayer wiring board
US10327799B2 (en) 2014-09-30 2019-06-25 Imott Inc. Scissors

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54157272A (en) * 1978-05-31 1979-12-12 Siemens Ag Method of producing conductive path laminated crossing
JPS5615052A (en) * 1979-07-18 1981-02-13 Hitachi Ltd Semiconductor device with multilayer wiring
WO2014102881A1 (en) * 2012-12-28 2014-07-03 国立大学法人東北大学 Semiconductor device, mis transistor, and multilayer wiring substrate
JPWO2014102880A1 (en) * 2012-12-28 2017-01-12 国立大学法人東北大学 Multilayer wiring board
JPWO2014102881A1 (en) * 2012-12-28 2017-01-12 国立大学法人東北大学 Multilayer wiring board
US10327799B2 (en) 2014-09-30 2019-06-25 Imott Inc. Scissors

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