JPS5310975A - Method of removing material from substrate - Google Patents

Method of removing material from substrate

Info

Publication number
JPS5310975A
JPS5310975A JP5302277A JP5302277A JPS5310975A JP S5310975 A JPS5310975 A JP S5310975A JP 5302277 A JP5302277 A JP 5302277A JP 5302277 A JP5302277 A JP 5302277A JP S5310975 A JPS5310975 A JP S5310975A
Authority
JP
Japan
Prior art keywords
substrate
removing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5302277A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5337707B2 (enExample
Inventor
Andoriyuu Geshiyunaa Robaato
Mitsuchieru Jiyunia Jiyosefu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of JPS5310975A publication Critical patent/JPS5310975A/ja
Publication of JPS5337707B2 publication Critical patent/JPS5337707B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
JP5302277A 1976-05-10 1977-05-09 Method of removing material from substrate Granted JPS5310975A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68496576A 1976-05-10 1976-05-10

Publications (2)

Publication Number Publication Date
JPS5310975A true JPS5310975A (en) 1978-01-31
JPS5337707B2 JPS5337707B2 (enExample) 1978-10-11

Family

ID=24750240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5302277A Granted JPS5310975A (en) 1976-05-10 1977-05-09 Method of removing material from substrate

Country Status (6)

Country Link
US (1) US4105468A (enExample)
JP (1) JPS5310975A (enExample)
DE (1) DE2719902A1 (enExample)
GB (1) GB1530978A (enExample)
PL (1) PL112654B1 (enExample)
SE (1) SE7705053L (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4350564A (en) * 1980-10-27 1982-09-21 General Electric Company Method of etching metallic materials including a major percentage of chromium
JPS57104141A (en) * 1980-12-22 1982-06-29 Dainippon Printing Co Ltd Photomask and photomask substrate
DE3249518T1 (de) * 1982-08-23 1984-09-06 Gravure Research Institute, Inc. (n.d.Ges.d. Staates Illinois), Port Washington, N.Y. Verfahren und Vorrichtung zur Herstellung von Tiefdruckzellen in einem Tiefdruckzylinder
GB2132789A (en) * 1982-11-24 1984-07-11 Western Electric Co Method of pattern generation
US4569695A (en) * 1983-04-21 1986-02-11 Nec Corporation Method of cleaning a photo-mask
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4984597B1 (en) * 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4713518A (en) * 1984-06-08 1987-12-15 Semiconductor Energy Laboratory Co., Ltd. Electronic device manufacturing methods
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
DE69233293T2 (de) * 1991-10-04 2004-11-18 CFMT, Inc., Wilmington Superreinigung von komplizierten Mikroteilchen
US6039059A (en) 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
US6165649A (en) * 1997-01-21 2000-12-26 International Business Machines Corporation Methods for repair of photomasks
US6843929B1 (en) * 2000-02-28 2005-01-18 International Business Machines Corporation Accelerated etching of chromium

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539408A (en) * 1967-08-11 1970-11-10 Western Electric Co Methods of etching chromium patterns and photolithographic masks so produced
US3673018A (en) * 1969-05-08 1972-06-27 Rca Corp Method of fabrication of photomasks
US3947801A (en) * 1975-01-23 1976-03-30 Rca Corporation Laser-trimmed resistor

Also Published As

Publication number Publication date
PL112654B1 (en) 1980-10-31
SE7705053L (sv) 1977-11-11
GB1530978A (en) 1978-11-01
PL197962A1 (pl) 1978-01-02
JPS5337707B2 (enExample) 1978-10-11
US4105468A (en) 1978-08-08
DE2719902A1 (de) 1977-11-24

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