JPS5288766A - Method of forming bonding pad - Google Patents

Method of forming bonding pad

Info

Publication number
JPS5288766A
JPS5288766A JP6114476A JP6114476A JPS5288766A JP S5288766 A JPS5288766 A JP S5288766A JP 6114476 A JP6114476 A JP 6114476A JP 6114476 A JP6114476 A JP 6114476A JP S5288766 A JPS5288766 A JP S5288766A
Authority
JP
Japan
Prior art keywords
bonding pad
forming bonding
forming
pad
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6114476A
Other languages
Japanese (ja)
Inventor
Isao Yamaguchi
Heiji Hashizume
Akira Nakazawa
Hiroshige Sugihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6114476A priority Critical patent/JPS5288766A/en
Publication of JPS5288766A publication Critical patent/JPS5288766A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125—Reinforcing structures
    • H01L2224/10126—Bump collar
JP6114476A 1976-05-28 1976-05-28 Method of forming bonding pad Pending JPS5288766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6114476A JPS5288766A (en) 1976-05-28 1976-05-28 Method of forming bonding pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6114476A JPS5288766A (en) 1976-05-28 1976-05-28 Method of forming bonding pad

Publications (1)

Publication Number Publication Date
JPS5288766A true JPS5288766A (en) 1977-07-25

Family

ID=13162600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6114476A Pending JPS5288766A (en) 1976-05-28 1976-05-28 Method of forming bonding pad

Country Status (1)

Country Link
JP (1) JPS5288766A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122870A (en) * 1978-03-17 1979-09-22 Tokyo Shibaura Electric Co Thick film circuit board
JPS6074189A (en) * 1983-09-29 1985-04-26 Fujitsu Ltd Magnetic bubble memory element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122870A (en) * 1978-03-17 1979-09-22 Tokyo Shibaura Electric Co Thick film circuit board
JPS6074189A (en) * 1983-09-29 1985-04-26 Fujitsu Ltd Magnetic bubble memory element
JPS6330715B2 (en) * 1983-09-29 1988-06-20 Fujitsu Ltd

Similar Documents

Publication Publication Date Title
JPS5331961A (en) Method of making semiconductor
JPS5340889A (en) Method of forming connecting leads
JPS52119086A (en) Method of forming ic
JPS52144768A (en) Method of connecting chip
JPS52151653A (en) Method of bonding two types of metallic members
JPS52106683A (en) Method of bonding semiconductor disk
JPS5288766A (en) Method of forming bonding pad
JPS53125185A (en) Method of bonding base of drum can
JPS5295061A (en) Bonding method
JPS5296868A (en) Method of bonding wires
JPS5458352A (en) Method of bonding wire
ZA772305B (en) Method of bonding
JPS5370095A (en) Method of making diamond
JPS52121933A (en) Method of embanking
JPS52102407A (en) Method of producing bumboo plates bonded laterally
JPS52105045A (en) Method of producing shoulder pad
JPS52108937A (en) Method of polybrominating bissphenoxyalkane
JPS51133760A (en) Method of manufacturing bonding pad
JPS5245055A (en) Method of bonding between parts
JPS5333790A (en) Method of forming package
JPS5310402A (en) Method of producing headphone pad
JPS5433661A (en) Method of bonding wires
JPS5371956A (en) Method of producing soulder pad for clothes
JPS5458354A (en) Method of bonding wire
JPS5458353A (en) Method of bonding wire