JPS5285800A - Method of removing scattered material - Google Patents

Method of removing scattered material

Info

Publication number
JPS5285800A
JPS5285800A JP210076A JP210076A JPS5285800A JP S5285800 A JPS5285800 A JP S5285800A JP 210076 A JP210076 A JP 210076A JP 210076 A JP210076 A JP 210076A JP S5285800 A JPS5285800 A JP S5285800A
Authority
JP
Japan
Prior art keywords
scattered material
removing scattered
adhering
remove
easy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP210076A
Other languages
Japanese (ja)
Inventor
Kenji Ushimi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP210076A priority Critical patent/JPS5285800A/en
Publication of JPS5285800A publication Critical patent/JPS5285800A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE: In laser processing, to cool scattered pieces rapidly to prevent them from adhering to a processed material and to make it possible to remove them with easy by making a continuous liquid flow under it.
COPYRIGHT: (C)1977,JPO&Japio
JP210076A 1976-01-12 1976-01-12 Method of removing scattered material Pending JPS5285800A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP210076A JPS5285800A (en) 1976-01-12 1976-01-12 Method of removing scattered material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP210076A JPS5285800A (en) 1976-01-12 1976-01-12 Method of removing scattered material

Publications (1)

Publication Number Publication Date
JPS5285800A true JPS5285800A (en) 1977-07-16

Family

ID=11519917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP210076A Pending JPS5285800A (en) 1976-01-12 1976-01-12 Method of removing scattered material

Country Status (1)

Country Link
JP (1) JPS5285800A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138600A (en) * 1981-02-20 1982-08-26 Hitachi Ltd Method of cutting and working hollow article
JPS63174793A (en) * 1987-01-14 1988-07-19 Daihen Corp Method for cutting alloy steel by laser beam
JPH04200889A (en) * 1990-11-29 1992-07-21 Mitsubishi Heavy Ind Ltd Cutting method by laser beam
US7067759B2 (en) 2002-04-24 2006-06-27 The Boc Group Plc Metal working
JP2006315030A (en) * 2005-05-12 2006-11-24 Shibaura Mechatronics Corp Thin film panel machining apparatus
JP2009125936A (en) * 2007-11-19 2009-06-11 Minoru Kasei Kk Method for making hole in blow molded body
CN101977723A (en) * 2008-03-24 2011-02-16 丸文株式会社 Beam processing apparatus, beam processing method, and beam processed substrate
JP2019520987A (en) * 2016-05-18 2019-07-25 フランクール, ゲイリーFrancoeur, Gary Milling and laser drilling systems

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138600A (en) * 1981-02-20 1982-08-26 Hitachi Ltd Method of cutting and working hollow article
JPS63174793A (en) * 1987-01-14 1988-07-19 Daihen Corp Method for cutting alloy steel by laser beam
JPH04200889A (en) * 1990-11-29 1992-07-21 Mitsubishi Heavy Ind Ltd Cutting method by laser beam
US7067759B2 (en) 2002-04-24 2006-06-27 The Boc Group Plc Metal working
JP2006315030A (en) * 2005-05-12 2006-11-24 Shibaura Mechatronics Corp Thin film panel machining apparatus
JP4762601B2 (en) * 2005-05-12 2011-08-31 芝浦メカトロニクス株式会社 Thin film panel processing equipment
JP2009125936A (en) * 2007-11-19 2009-06-11 Minoru Kasei Kk Method for making hole in blow molded body
CN101977723A (en) * 2008-03-24 2011-02-16 丸文株式会社 Beam processing apparatus, beam processing method, and beam processed substrate
JP2019520987A (en) * 2016-05-18 2019-07-25 フランクール, ゲイリーFrancoeur, Gary Milling and laser drilling systems

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