JPS527422B2 - - Google Patents
Info
- Publication number
- JPS527422B2 JPS527422B2 JP8247372A JP8247372A JPS527422B2 JP S527422 B2 JPS527422 B2 JP S527422B2 JP 8247372 A JP8247372 A JP 8247372A JP 8247372 A JP8247372 A JP 8247372A JP S527422 B2 JPS527422 B2 JP S527422B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8247372A JPS527422B2 (ko) | 1972-08-19 | 1972-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8247372A JPS527422B2 (ko) | 1972-08-19 | 1972-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4938858A JPS4938858A (ko) | 1974-04-11 |
| JPS527422B2 true JPS527422B2 (ko) | 1977-03-02 |
Family
ID=13775467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8247372A Expired JPS527422B2 (ko) | 1972-08-19 | 1972-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS527422B2 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125855A1 (ja) * | 2014-02-24 | 2015-08-27 | 株式会社弘輝 | 鉛フリーはんだ合金、はんだ材料及び接合構造体 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196268A (ko) * | 1975-02-20 | 1976-08-24 | ||
| JPS526468A (en) * | 1975-07-04 | 1977-01-18 | Sumitomo Metal Mining Co Ltd | Brazing material |
| US5411703A (en) * | 1993-06-16 | 1995-05-02 | International Business Machines Corporation | Lead-free, tin, antimony, bismtuh, copper solder alloy |
| US5368814A (en) * | 1993-06-16 | 1994-11-29 | International Business Machines, Inc. | Lead free, tin-bismuth solder alloys |
| US5393489A (en) * | 1993-06-16 | 1995-02-28 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
| DE10319888A1 (de) | 2003-04-25 | 2004-11-25 | Siemens Ag | Lotmaterial auf SnAgCu-Basis |
| JP6200534B2 (ja) * | 2015-03-24 | 2017-09-20 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| EP3449023B1 (en) * | 2016-05-06 | 2022-04-20 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
| DE112020000278B4 (de) | 2019-05-27 | 2023-07-06 | Senju Metal Industry Co., Ltd. | Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle |
-
1972
- 1972-08-19 JP JP8247372A patent/JPS527422B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125855A1 (ja) * | 2014-02-24 | 2015-08-27 | 株式会社弘輝 | 鉛フリーはんだ合金、はんだ材料及び接合構造体 |
| CN106061669A (zh) * | 2014-02-24 | 2016-10-26 | 株式会社弘辉 | 无铅钎焊合金、钎焊材料及接合结构体 |
| JPWO2015125855A1 (ja) * | 2014-02-24 | 2017-03-30 | 株式会社弘輝 | 鉛フリーはんだ合金、はんだ材料及び接合構造体 |
| US9764430B2 (en) | 2014-02-24 | 2017-09-19 | Koki Company Limited | Lead-free solder alloy, solder material and joined structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4938858A (ko) | 1974-04-11 |