JPS5272342A - Surface treating agent for copper - Google Patents

Surface treating agent for copper

Info

Publication number
JPS5272342A
JPS5272342A JP14838575A JP14838575A JPS5272342A JP S5272342 A JPS5272342 A JP S5272342A JP 14838575 A JP14838575 A JP 14838575A JP 14838575 A JP14838575 A JP 14838575A JP S5272342 A JPS5272342 A JP S5272342A
Authority
JP
Japan
Prior art keywords
copper
treating agent
surface treating
agent
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14838575A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5618077B2 (OSRAM
Inventor
Hitoshi Oka
Hitomi Nagayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14838575A priority Critical patent/JPS5272342A/ja
Publication of JPS5272342A publication Critical patent/JPS5272342A/ja
Publication of JPS5618077B2 publication Critical patent/JPS5618077B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14838575A 1975-12-15 1975-12-15 Surface treating agent for copper Granted JPS5272342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14838575A JPS5272342A (en) 1975-12-15 1975-12-15 Surface treating agent for copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14838575A JPS5272342A (en) 1975-12-15 1975-12-15 Surface treating agent for copper

Publications (2)

Publication Number Publication Date
JPS5272342A true JPS5272342A (en) 1977-06-16
JPS5618077B2 JPS5618077B2 (OSRAM) 1981-04-25

Family

ID=15451572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14838575A Granted JPS5272342A (en) 1975-12-15 1975-12-15 Surface treating agent for copper

Country Status (1)

Country Link
JP (1) JPS5272342A (OSRAM)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6257795A (ja) * 1985-09-04 1987-03-13 Electroplating Eng Of Japan Co 水溶性フラツクス
JPS632397A (ja) * 1986-06-23 1988-01-07 株式会社日立製作所 プリント配線板の製造方法
CN1034820C (zh) * 1994-12-01 1997-05-07 西安交通大学 电解电容器阳极铝箔的腐蚀工艺
JPH10280161A (ja) * 1997-04-07 1998-10-20 Sanwa Kenkyusho:Kk 銅金共存基板の表面保護剤および表面保護膜の形成方法。
JP2014084491A (ja) * 2012-10-23 2014-05-12 Shikoku Chem Corp 銅の表面処理剤および表面処理方法
US8853551B2 (en) 2010-05-21 2014-10-07 Nitto Denko Corporation Wired circuit board and producing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170183783A1 (en) * 2015-12-29 2017-06-29 Rohm And Haas Electronic Materials Llc Method for forming organic coating on copper surface

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825621A (OSRAM) * 1971-08-09 1973-04-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825621A (OSRAM) * 1971-08-09 1973-04-03

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6257795A (ja) * 1985-09-04 1987-03-13 Electroplating Eng Of Japan Co 水溶性フラツクス
JPS632397A (ja) * 1986-06-23 1988-01-07 株式会社日立製作所 プリント配線板の製造方法
CN1034820C (zh) * 1994-12-01 1997-05-07 西安交通大学 电解电容器阳极铝箔的腐蚀工艺
JPH10280161A (ja) * 1997-04-07 1998-10-20 Sanwa Kenkyusho:Kk 銅金共存基板の表面保護剤および表面保護膜の形成方法。
US8853551B2 (en) 2010-05-21 2014-10-07 Nitto Denko Corporation Wired circuit board and producing method thereof
JP2014084491A (ja) * 2012-10-23 2014-05-12 Shikoku Chem Corp 銅の表面処理剤および表面処理方法

Also Published As

Publication number Publication date
JPS5618077B2 (OSRAM) 1981-04-25

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