JPS5272342A - Surface treating agent for copper - Google Patents
Surface treating agent for copperInfo
- Publication number
- JPS5272342A JPS5272342A JP14838575A JP14838575A JPS5272342A JP S5272342 A JPS5272342 A JP S5272342A JP 14838575 A JP14838575 A JP 14838575A JP 14838575 A JP14838575 A JP 14838575A JP S5272342 A JPS5272342 A JP S5272342A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- treating agent
- surface treating
- agent
- treating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14838575A JPS5272342A (en) | 1975-12-15 | 1975-12-15 | Surface treating agent for copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14838575A JPS5272342A (en) | 1975-12-15 | 1975-12-15 | Surface treating agent for copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5272342A true JPS5272342A (en) | 1977-06-16 |
| JPS5618077B2 JPS5618077B2 (OSRAM) | 1981-04-25 |
Family
ID=15451572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14838575A Granted JPS5272342A (en) | 1975-12-15 | 1975-12-15 | Surface treating agent for copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5272342A (OSRAM) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6257795A (ja) * | 1985-09-04 | 1987-03-13 | Electroplating Eng Of Japan Co | 水溶性フラツクス |
| JPS632397A (ja) * | 1986-06-23 | 1988-01-07 | 株式会社日立製作所 | プリント配線板の製造方法 |
| CN1034820C (zh) * | 1994-12-01 | 1997-05-07 | 西安交通大学 | 电解电容器阳极铝箔的腐蚀工艺 |
| JPH10280161A (ja) * | 1997-04-07 | 1998-10-20 | Sanwa Kenkyusho:Kk | 銅金共存基板の表面保護剤および表面保護膜の形成方法。 |
| JP2014084491A (ja) * | 2012-10-23 | 2014-05-12 | Shikoku Chem Corp | 銅の表面処理剤および表面処理方法 |
| US8853551B2 (en) | 2010-05-21 | 2014-10-07 | Nitto Denko Corporation | Wired circuit board and producing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170183783A1 (en) * | 2015-12-29 | 2017-06-29 | Rohm And Haas Electronic Materials Llc | Method for forming organic coating on copper surface |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825621A (OSRAM) * | 1971-08-09 | 1973-04-03 |
-
1975
- 1975-12-15 JP JP14838575A patent/JPS5272342A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825621A (OSRAM) * | 1971-08-09 | 1973-04-03 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6257795A (ja) * | 1985-09-04 | 1987-03-13 | Electroplating Eng Of Japan Co | 水溶性フラツクス |
| JPS632397A (ja) * | 1986-06-23 | 1988-01-07 | 株式会社日立製作所 | プリント配線板の製造方法 |
| CN1034820C (zh) * | 1994-12-01 | 1997-05-07 | 西安交通大学 | 电解电容器阳极铝箔的腐蚀工艺 |
| JPH10280161A (ja) * | 1997-04-07 | 1998-10-20 | Sanwa Kenkyusho:Kk | 銅金共存基板の表面保護剤および表面保護膜の形成方法。 |
| US8853551B2 (en) | 2010-05-21 | 2014-10-07 | Nitto Denko Corporation | Wired circuit board and producing method thereof |
| JP2014084491A (ja) * | 2012-10-23 | 2014-05-12 | Shikoku Chem Corp | 銅の表面処理剤および表面処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5618077B2 (OSRAM) | 1981-04-25 |
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