JPS5261962A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5261962A JPS5261962A JP13845575A JP13845575A JPS5261962A JP S5261962 A JPS5261962 A JP S5261962A JP 13845575 A JP13845575 A JP 13845575A JP 13845575 A JP13845575 A JP 13845575A JP S5261962 A JPS5261962 A JP S5261962A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- enclosure
- large power
- rectifying element
- flat type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To strengthen protection for an enclosure in a flat type rectifying element for large power.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13845575A JPS5261962A (en) | 1975-11-18 | 1975-11-18 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13845575A JPS5261962A (en) | 1975-11-18 | 1975-11-18 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5261962A true JPS5261962A (en) | 1977-05-21 |
Family
ID=15222402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13845575A Pending JPS5261962A (en) | 1975-11-18 | 1975-11-18 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5261962A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008084926A (en) * | 2006-09-26 | 2008-04-10 | Mitsubishi Electric Corp | Pressure-contact semiconductor device |
-
1975
- 1975-11-18 JP JP13845575A patent/JPS5261962A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008084926A (en) * | 2006-09-26 | 2008-04-10 | Mitsubishi Electric Corp | Pressure-contact semiconductor device |
US8456001B2 (en) | 2006-09-26 | 2013-06-04 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
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