JPS5259573A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5259573A
JPS5259573A JP50135277A JP13527775A JPS5259573A JP S5259573 A JPS5259573 A JP S5259573A JP 50135277 A JP50135277 A JP 50135277A JP 13527775 A JP13527775 A JP 13527775A JP S5259573 A JPS5259573 A JP S5259573A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
allowing
reduction
pass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50135277A
Other languages
English (en)
Inventor
Makoto Shimanuki
Hiroshi Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50135277A priority Critical patent/JPS5259573A/ja
Publication of JPS5259573A publication Critical patent/JPS5259573A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP50135277A 1975-11-11 1975-11-11 Production of semiconductor device Pending JPS5259573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50135277A JPS5259573A (en) 1975-11-11 1975-11-11 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50135277A JPS5259573A (en) 1975-11-11 1975-11-11 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5259573A true JPS5259573A (en) 1977-05-17

Family

ID=15147935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50135277A Pending JPS5259573A (en) 1975-11-11 1975-11-11 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5259573A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563854A (en) * 1978-11-08 1980-05-14 Nec Kyushu Ltd Method of manufacturing semiconductor device
JPS55103753A (en) * 1979-02-05 1980-08-08 Hitachi Ltd Electronic component
JPS59123247A (ja) * 1982-12-28 1984-07-17 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61212032A (ja) * 1985-03-15 1986-09-20 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563854A (en) * 1978-11-08 1980-05-14 Nec Kyushu Ltd Method of manufacturing semiconductor device
JPS55103753A (en) * 1979-02-05 1980-08-08 Hitachi Ltd Electronic component
JPS59123247A (ja) * 1982-12-28 1984-07-17 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61212032A (ja) * 1985-03-15 1986-09-20 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

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