JPS5240069A - Insulator vessel sealed type semiconductor device and process for prod uction of same - Google Patents

Insulator vessel sealed type semiconductor device and process for prod uction of same

Info

Publication number
JPS5240069A
JPS5240069A JP50115630A JP11563075A JPS5240069A JP S5240069 A JPS5240069 A JP S5240069A JP 50115630 A JP50115630 A JP 50115630A JP 11563075 A JP11563075 A JP 11563075A JP S5240069 A JPS5240069 A JP S5240069A
Authority
JP
Japan
Prior art keywords
semiconductor device
same
type semiconductor
sealed type
vessel sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50115630A
Other languages
Japanese (ja)
Inventor
Junji Harayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50115630A priority Critical patent/JPS5240069A/en
Publication of JPS5240069A publication Critical patent/JPS5240069A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Abstract

PURPOSE: A lower ceramic plate is mutually fitted to an upper ceramic plate and in this condition both are bound, whereby the reduction in the number of sealing steps is achieved and the tightness of the seal is enhanced.
COPYRIGHT: (C)1977,JPO&Japio
JP50115630A 1975-09-26 1975-09-26 Insulator vessel sealed type semiconductor device and process for prod uction of same Pending JPS5240069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50115630A JPS5240069A (en) 1975-09-26 1975-09-26 Insulator vessel sealed type semiconductor device and process for prod uction of same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50115630A JPS5240069A (en) 1975-09-26 1975-09-26 Insulator vessel sealed type semiconductor device and process for prod uction of same

Publications (1)

Publication Number Publication Date
JPS5240069A true JPS5240069A (en) 1977-03-28

Family

ID=14667394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50115630A Pending JPS5240069A (en) 1975-09-26 1975-09-26 Insulator vessel sealed type semiconductor device and process for prod uction of same

Country Status (1)

Country Link
JP (1) JPS5240069A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984002613A1 (en) * 1982-12-20 1984-07-05 Motorola Inc Integrated circuit carrier and assembly
JPS6032341A (en) * 1983-08-02 1985-02-19 Nec Corp Semiconductor device
JPS63242693A (en) * 1987-03-31 1988-10-07 三菱電機株式会社 Semiconductor-device card
US5256901A (en) * 1988-12-26 1993-10-26 Ngk Insulators, Ltd. Ceramic package for memory semiconductor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984002613A1 (en) * 1982-12-20 1984-07-05 Motorola Inc Integrated circuit carrier and assembly
JPS6032341A (en) * 1983-08-02 1985-02-19 Nec Corp Semiconductor device
JPH041500B2 (en) * 1983-08-02 1992-01-13 Nippon Electric Co
JPS63242693A (en) * 1987-03-31 1988-10-07 三菱電機株式会社 Semiconductor-device card
US5256901A (en) * 1988-12-26 1993-10-26 Ngk Insulators, Ltd. Ceramic package for memory semiconductor

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