JPS5238217B1 - - Google Patents
Info
- Publication number
- JPS5238217B1 JPS5238217B1 JP47022676A JP2267672A JPS5238217B1 JP S5238217 B1 JPS5238217 B1 JP S5238217B1 JP 47022676 A JP47022676 A JP 47022676A JP 2267672 A JP2267672 A JP 2267672A JP S5238217 B1 JPS5238217 B1 JP S5238217B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Continuous-Control Power Sources That Use Transistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Television Receiver Circuits (AREA)
- Circuits Of Receivers In General (AREA)
- Dc-Dc Converters (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12106371A | 1971-03-04 | 1971-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5238217B1 true JPS5238217B1 (https=) | 1977-09-28 |
Family
ID=22394259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47022676A Pending JPS5238217B1 (https=) | 1971-03-04 | 1972-03-03 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3710193A (https=) |
| JP (1) | JPS5238217B1 (https=) |
| CA (1) | CA945632A (https=) |
| DE (1) | DE2163002C2 (https=) |
| FR (1) | FR2128620B1 (https=) |
| GB (1) | GB1356368A (https=) |
| IL (1) | IL38240A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61146820A (ja) * | 1984-12-17 | 1986-07-04 | Murata Mach Ltd | ドラフト装置 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2536957C2 (de) * | 1975-08-20 | 1983-05-11 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Elektronisches Bauelement |
| JPS595935Y2 (ja) * | 1979-08-08 | 1984-02-23 | アルプス電気株式会社 | 厚膜印刷回路 |
| GB2167906B (en) * | 1984-11-23 | 1988-08-10 | Gec Avionics | Rack mounted circuit module |
| DE3538933A1 (de) * | 1985-11-02 | 1987-05-14 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
| EP0249766B1 (de) * | 1986-06-14 | 1991-12-04 | Peter Hofsäss | Isoliergehäuse für Thermoschalter |
| US4858069A (en) * | 1988-08-08 | 1989-08-15 | Gte Spacenet Corporation | Electronic housing for a satellite earth station |
| DE3837975A1 (de) * | 1988-11-09 | 1990-05-10 | Telefunken Electronic Gmbh | Elektronisches steuergeraet |
| FR2652982B1 (fr) * | 1989-10-11 | 1993-04-30 | Alsthom Gec | Assemblage de composants en electronique de puissance. |
| JP2705368B2 (ja) * | 1991-05-31 | 1998-01-28 | 株式会社デンソー | 電子装置 |
| US5646827A (en) * | 1991-05-31 | 1997-07-08 | Nippondenso Co., Ltd. | Electronic device having a plurality of circuit boards arranged therein |
| EP0516149B1 (en) * | 1991-05-31 | 1998-09-23 | Denso Corporation | Electronic device |
| US5586388A (en) * | 1991-05-31 | 1996-12-24 | Nippondenso Co., Ltd. | Method for producing multi-board electronic device |
| JP2765278B2 (ja) * | 1991-05-31 | 1998-06-11 | 株式会社デンソー | 電子装置の製造方法 |
| US5305186A (en) * | 1993-01-27 | 1994-04-19 | International Business Machines Corporation | Power carrier with selective thermal performance |
| JPH0965662A (ja) * | 1995-08-28 | 1997-03-07 | Fuji Electric Co Ltd | パワーモジュール |
| DE19654606C2 (de) * | 1996-12-20 | 1998-10-22 | Siemens Ag | Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung |
| FR2781647B1 (fr) * | 1998-07-31 | 2000-10-13 | Gervais Danone Co | Procede de sterilisation d'un produit alimentaire a faible teneur en eau, produit alimentaire obtenu et composition alimentaire le contenant |
| DE10218530B4 (de) * | 2002-04-25 | 2005-02-24 | Infineon Technologies Ag | Integrierte Schaltung mit thermisch abgeschirmter elektrischer Widerstandsbahn |
| US20060097704A1 (en) * | 2004-11-05 | 2006-05-11 | Wetherill Associates, Inc. | Voltage regulator and method using substrate board with insulator layer and conductive traces |
| DE102005003245B4 (de) * | 2005-01-24 | 2008-05-29 | Infineon Technologies Ag | Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems |
| US8018056B2 (en) * | 2005-12-21 | 2011-09-13 | International Rectifier Corporation | Package for high power density devices |
| CA2759961C (en) * | 2009-05-13 | 2013-12-17 | Greatpoint Energy, Inc. | Processes for hydromethanation of a carbonaceous feedstock |
| CN108334146B (zh) * | 2018-04-08 | 2024-08-09 | 杭州欣美成套电器制造有限公司 | 一种断线检测的恒流驱动电路 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3346773A (en) * | 1967-10-10 | Multilayer conductor board assembly | ||
| US2933655A (en) * | 1957-01-31 | 1960-04-19 | Sylvania Electric Prod | Electronic equipment packaging |
| US3261904A (en) * | 1963-09-16 | 1966-07-19 | United Aircraft Corp | Transistor mounting and heat transfer apparatus with adjustable pressure detachable mounting means |
| US3308271A (en) * | 1964-06-08 | 1967-03-07 | Fairchild Camera Instr Co | Constant temperature environment for semiconductor circuit elements |
| US3391728A (en) * | 1964-07-03 | 1968-07-09 | Trw Inc | Thermal valve |
| US3393328A (en) * | 1964-09-04 | 1968-07-16 | Texas Instruments Inc | Thermal coupling elements |
| SE310913B (https=) * | 1964-10-17 | 1969-05-19 | Asea Ab | |
| USB411062I5 (https=) * | 1964-11-13 | |||
| US3364395A (en) * | 1965-01-26 | 1968-01-16 | Burroughs Corp | Modular data processing apparatus including heat dissipating means |
| US3444399A (en) * | 1965-09-24 | 1969-05-13 | Westinghouse Electric Corp | Temperature controlled electronic devices |
| US3609593A (en) * | 1966-05-25 | 1971-09-28 | Bell Telephone Labor Inc | Vibratory reed device |
| SE334947B (https=) * | 1967-05-08 | 1971-05-10 | Asea Ab | |
| US3476981A (en) * | 1967-10-10 | 1969-11-04 | Gen Motors Corp | Miniature power circuit assembly |
| DE1614640B1 (de) * | 1967-10-26 | 1971-12-02 | Siemens Ag | Gleichrichteranordnung |
-
1971
- 1971-03-04 US US00121063A patent/US3710193A/en not_active Expired - Lifetime
- 1971-11-26 IL IL38240A patent/IL38240A/xx unknown
- 1971-12-18 DE DE2163002A patent/DE2163002C2/de not_active Expired
-
1972
- 1972-03-03 CA CA136,206A patent/CA945632A/en not_active Expired
- 1972-03-03 JP JP47022676A patent/JPS5238217B1/ja active Pending
- 1972-03-03 FR FR7207557A patent/FR2128620B1/fr not_active Expired
- 1972-03-03 GB GB1000772A patent/GB1356368A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61146820A (ja) * | 1984-12-17 | 1986-07-04 | Murata Mach Ltd | ドラフト装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2128620A1 (https=) | 1972-10-20 |
| IL38240A0 (en) | 1972-01-27 |
| DE2163002A1 (https=) | 1972-09-07 |
| DE2163002C2 (de) | 1982-12-30 |
| CA945632A (en) | 1974-04-16 |
| IL38240A (en) | 1975-12-31 |
| GB1356368A (en) | 1974-06-12 |
| FR2128620B1 (https=) | 1975-10-24 |
| US3710193A (en) | 1973-01-09 |