JPS5234670A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5234670A
JPS5234670A JP50100442A JP10044275A JPS5234670A JP S5234670 A JPS5234670 A JP S5234670A JP 50100442 A JP50100442 A JP 50100442A JP 10044275 A JP10044275 A JP 10044275A JP S5234670 A JPS5234670 A JP S5234670A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealed
junction
keeping
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50100442A
Other languages
Japanese (ja)
Other versions
JPS5241192B2 (en
Inventor
Kanji Mizukoshi
Yoichi Okabayashi
Goro Hagio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP50100442A priority Critical patent/JPS5234670A/en
Publication of JPS5234670A publication Critical patent/JPS5234670A/en
Publication of JPS5241192B2 publication Critical patent/JPS5241192B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent the increase of reverse blocking current caused in working conditions of PN junction by keeping an organic chelate agent in the circumference of the metal-sealed or resin-sealed semiconductor device.
COPYRIGHT: (C)1977,JPO&Japio
JP50100442A 1975-08-18 1975-08-18 Semiconductor device Granted JPS5234670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50100442A JPS5234670A (en) 1975-08-18 1975-08-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50100442A JPS5234670A (en) 1975-08-18 1975-08-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5234670A true JPS5234670A (en) 1977-03-16
JPS5241192B2 JPS5241192B2 (en) 1977-10-17

Family

ID=14274036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50100442A Granted JPS5234670A (en) 1975-08-18 1975-08-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5234670A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS5689944A (en) * 1979-12-25 1981-07-21 Sumitomo Bakelite Co Thermoocontractive film and its manufacture

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53148589U (en) * 1977-04-27 1978-11-22
JPS5431984A (en) * 1977-08-13 1979-03-09 Yamada Youjirou Curing instrument
JPS568689Y2 (en) * 1978-06-22 1981-02-25
JPS552447A (en) * 1978-06-22 1980-01-09 Nippon Medix Kk Lowwfrequency placing needle treatment system
JPS61100442U (en) * 1984-12-04 1986-06-26

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS5689944A (en) * 1979-12-25 1981-07-21 Sumitomo Bakelite Co Thermoocontractive film and its manufacture
JPS625060B2 (en) * 1979-12-25 1987-02-03 Sumitomo Bakelite Co

Also Published As

Publication number Publication date
JPS5241192B2 (en) 1977-10-17

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