JPS5234670A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5234670A
JPS5234670A JP50100442A JP10044275A JPS5234670A JP S5234670 A JPS5234670 A JP S5234670A JP 50100442 A JP50100442 A JP 50100442A JP 10044275 A JP10044275 A JP 10044275A JP S5234670 A JPS5234670 A JP S5234670A
Authority
JP
Japan
Prior art keywords
semiconductor
sealed
junction
keeping
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50100442A
Other languages
Japanese (ja)
Other versions
JPS5241192B2 (en
Inventor
Goro Hagio
Kanji Mizukoshi
Yoichi Okabayashi
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP50100442A priority Critical patent/JPS5241192B2/ja
Publication of JPS5234670A publication Critical patent/JPS5234670A/en
Publication of JPS5241192B2 publication Critical patent/JPS5241192B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE: To prevent the increase of reverse blocking current caused in working conditions of PN junction by keeping an organic chelate agent in the circumference of the metal-sealed or resin-sealed semiconductor device.
COPYRIGHT: (C)1977,JPO&Japio
JP50100442A 1975-08-18 1975-08-18 Expired JPS5241192B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50100442A JPS5241192B2 (en) 1975-08-18 1975-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50100442A JPS5241192B2 (en) 1975-08-18 1975-08-18

Publications (2)

Publication Number Publication Date
JPS5234670A true JPS5234670A (en) 1977-03-16
JPS5241192B2 JPS5241192B2 (en) 1977-10-17

Family

ID=14274036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50100442A Expired JPS5241192B2 (en) 1975-08-18 1975-08-18

Country Status (1)

Country Link
JP (1) JPS5241192B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS5689944A (en) * 1979-12-25 1981-07-21 Sumitomo Bakelite Co Thermoocontractive film and its manufacture

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53148589U (en) * 1977-04-27 1978-11-22
JPS577747B2 (en) * 1977-08-13 1982-02-12
JPS568689Y2 (en) * 1978-06-22 1981-02-25
JPS5630029B2 (en) * 1978-06-22 1981-07-11
JPS61100442U (en) * 1984-12-04 1986-06-26

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS5689944A (en) * 1979-12-25 1981-07-21 Sumitomo Bakelite Co Thermoocontractive film and its manufacture
JPS625060B2 (en) * 1979-12-25 1987-02-03 Sumitomo Bakelite Co

Also Published As

Publication number Publication date
JPS5241192B2 (en) 1977-10-17

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