JPS5232668A - Semiconductor waffer processing equipment - Google Patents

Semiconductor waffer processing equipment

Info

Publication number
JPS5232668A
JPS5232668A JP10806275A JP10806275A JPS5232668A JP S5232668 A JPS5232668 A JP S5232668A JP 10806275 A JP10806275 A JP 10806275A JP 10806275 A JP10806275 A JP 10806275A JP S5232668 A JPS5232668 A JP S5232668A
Authority
JP
Japan
Prior art keywords
waffer
semiconductor
processing equipment
wafer
becomes possible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10806275A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5342661B2 (enExample
Inventor
Koji Kuwabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Techxiv Corp
Original Assignee
Komatsu Electronic Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Electronic Metals Co Ltd filed Critical Komatsu Electronic Metals Co Ltd
Priority to JP10806275A priority Critical patent/JPS5232668A/ja
Publication of JPS5232668A publication Critical patent/JPS5232668A/ja
Publication of JPS5342661B2 publication Critical patent/JPS5342661B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP10806275A 1975-09-08 1975-09-08 Semiconductor waffer processing equipment Granted JPS5232668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10806275A JPS5232668A (en) 1975-09-08 1975-09-08 Semiconductor waffer processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10806275A JPS5232668A (en) 1975-09-08 1975-09-08 Semiconductor waffer processing equipment

Publications (2)

Publication Number Publication Date
JPS5232668A true JPS5232668A (en) 1977-03-12
JPS5342661B2 JPS5342661B2 (enExample) 1978-11-14

Family

ID=14474922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10806275A Granted JPS5232668A (en) 1975-09-08 1975-09-08 Semiconductor waffer processing equipment

Country Status (1)

Country Link
JP (1) JPS5232668A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722964B2 (en) 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144073U (enExample) * 1985-02-26 1986-09-05

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722964B2 (en) 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
US6935932B2 (en) 2000-04-04 2005-08-30 Ebara Corporation Polishing apparatus and method
US7108589B2 (en) 2000-04-04 2006-09-19 Ebara Corporation Polishing apparatus and method

Also Published As

Publication number Publication date
JPS5342661B2 (enExample) 1978-11-14

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