JPS52144336A - Plating amount controlling method and method of fabricating detecting electrode in said method - Google Patents

Plating amount controlling method and method of fabricating detecting electrode in said method

Info

Publication number
JPS52144336A
JPS52144336A JP6197276A JP6197276A JPS52144336A JP S52144336 A JPS52144336 A JP S52144336A JP 6197276 A JP6197276 A JP 6197276A JP 6197276 A JP6197276 A JP 6197276A JP S52144336 A JPS52144336 A JP S52144336A
Authority
JP
Japan
Prior art keywords
fabricating
detecting electrode
plating amount
amount controlling
controlling method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6197276A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5547115B2 (Direct
Inventor
Hitoshi Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP6197276A priority Critical patent/JPS52144336A/ja
Publication of JPS52144336A publication Critical patent/JPS52144336A/ja
Publication of JPS5547115B2 publication Critical patent/JPS5547115B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP6197276A 1976-05-28 1976-05-28 Plating amount controlling method and method of fabricating detecting electrode in said method Granted JPS52144336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6197276A JPS52144336A (en) 1976-05-28 1976-05-28 Plating amount controlling method and method of fabricating detecting electrode in said method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6197276A JPS52144336A (en) 1976-05-28 1976-05-28 Plating amount controlling method and method of fabricating detecting electrode in said method

Publications (2)

Publication Number Publication Date
JPS52144336A true JPS52144336A (en) 1977-12-01
JPS5547115B2 JPS5547115B2 (Direct) 1980-11-27

Family

ID=13186590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6197276A Granted JPS52144336A (en) 1976-05-28 1976-05-28 Plating amount controlling method and method of fabricating detecting electrode in said method

Country Status (1)

Country Link
JP (1) JPS52144336A (Direct)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683936A (en) * 1979-12-13 1981-07-08 Mitsubishi Electric Corp Production of semiconductor device
JPS60224795A (ja) * 1984-03-22 1985-11-09 シエ−リング・アクチエンゲゼルシヤフト 電気メツキ浴中の電流密度を測定する方法
WO2018087807A1 (ja) * 2016-11-08 2018-05-17 三菱電機株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374112A (en) * 1964-03-05 1968-03-19 Yeda Res & Dev Method and apparatus for controlled deposition of a thin conductive layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374112A (en) * 1964-03-05 1968-03-19 Yeda Res & Dev Method and apparatus for controlled deposition of a thin conductive layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683936A (en) * 1979-12-13 1981-07-08 Mitsubishi Electric Corp Production of semiconductor device
JPS60224795A (ja) * 1984-03-22 1985-11-09 シエ−リング・アクチエンゲゼルシヤフト 電気メツキ浴中の電流密度を測定する方法
WO2018087807A1 (ja) * 2016-11-08 2018-05-17 三菱電機株式会社 半導体装置
CN109923647A (zh) * 2016-11-08 2019-06-21 三菱电机株式会社 半导体装置
US10804169B2 (en) 2016-11-08 2020-10-13 Mitsubishi Electric Corporation Semiconductor device
CN109923647B (zh) * 2016-11-08 2023-06-20 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
JPS5547115B2 (Direct) 1980-11-27

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