JPS52135668A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS52135668A JPS52135668A JP5341776A JP5341776A JPS52135668A JP S52135668 A JPS52135668 A JP S52135668A JP 5341776 A JP5341776 A JP 5341776A JP 5341776 A JP5341776 A JP 5341776A JP S52135668 A JPS52135668 A JP S52135668A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- metal film
- wirings
- thinning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To considerably reduce the number of operating steps and increase the adhesion of a metal film by using plasma etching at the time of thinning the rear surface of a semiconductor substrate formed with semiconductor elements and wirings on the front surface by partly removing it and depositing a metal film thereon.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5341776A JPS52135668A (en) | 1976-05-10 | 1976-05-10 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5341776A JPS52135668A (en) | 1976-05-10 | 1976-05-10 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52135668A true JPS52135668A (en) | 1977-11-12 |
Family
ID=12942250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5341776A Pending JPS52135668A (en) | 1976-05-10 | 1976-05-10 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52135668A (en) |
-
1976
- 1976-05-10 JP JP5341776A patent/JPS52135668A/en active Pending
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