Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co LtdfiledCriticalToshiba Corp
Priority to JP4455576ApriorityCriticalpatent/JPS52127161A/en
Publication of JPS52127161ApublicationCriticalpatent/JPS52127161A/en
PURPOSE: To reduce oxidization of the surface of fitting part material by fixing to bind in the heating atmosphere of hydrogen or mixing gas of hydrogen and nonoxidizing gas when the semiconductor is adhered on the fitting part material such as stem through the metal eutectic layer.
COPYRIGHT: (C)1977,JPO&Japio
JP4455576A1976-04-191976-04-19Manufacture of semiconductor
PendingJPS52127161A
(en)