JPS52127067A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS52127067A
JPS52127067A JP4336076A JP4336076A JPS52127067A JP S52127067 A JPS52127067 A JP S52127067A JP 4336076 A JP4336076 A JP 4336076A JP 4336076 A JP4336076 A JP 4336076A JP S52127067 A JPS52127067 A JP S52127067A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding method
bonding
distance
actual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4336076A
Other languages
Japanese (ja)
Other versions
JPS5711498B2 (en
Inventor
Nobuhito Yamazaki
Hirota Akagawa
Minoru Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Hitachi Ltd
Original Assignee
Shinkawa Ltd
Hitachi Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Hitachi Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP4336076A priority Critical patent/JPS52127067A/en
Publication of JPS52127067A publication Critical patent/JPS52127067A/en
Publication of JPS5711498B2 publication Critical patent/JPS5711498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To effect bonding at an exact position by calculating the actual coordinate for the bonding point based on the ratio of the distance between two regular points to the actual distance and setting a bonding tool to the above point.
COPYRIGHT: (C)1977,JPO&Japio
JP4336076A 1976-04-16 1976-04-16 Wire bonding method Granted JPS52127067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4336076A JPS52127067A (en) 1976-04-16 1976-04-16 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4336076A JPS52127067A (en) 1976-04-16 1976-04-16 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS52127067A true JPS52127067A (en) 1977-10-25
JPS5711498B2 JPS5711498B2 (en) 1982-03-04

Family

ID=12661676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4336076A Granted JPS52127067A (en) 1976-04-16 1976-04-16 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS52127067A (en)

Also Published As

Publication number Publication date
JPS5711498B2 (en) 1982-03-04

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