JPS5711498B2 - - Google Patents
Info
- Publication number
- JPS5711498B2 JPS5711498B2 JP4336076A JP4336076A JPS5711498B2 JP S5711498 B2 JPS5711498 B2 JP S5711498B2 JP 4336076 A JP4336076 A JP 4336076A JP 4336076 A JP4336076 A JP 4336076A JP S5711498 B2 JPS5711498 B2 JP S5711498B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336076A JPS52127067A (en) | 1976-04-16 | 1976-04-16 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336076A JPS52127067A (en) | 1976-04-16 | 1976-04-16 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52127067A JPS52127067A (en) | 1977-10-25 |
| JPS5711498B2 true JPS5711498B2 (en) | 1982-03-04 |
Family
ID=12661676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4336076A Granted JPS52127067A (en) | 1976-04-16 | 1976-04-16 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52127067A (en) |
-
1976
- 1976-04-16 JP JP4336076A patent/JPS52127067A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52127067A (en) | 1977-10-25 |