JPS52126758U - - Google Patents
Info
- Publication number
- JPS52126758U JPS52126758U JP1976034878U JP3487876U JPS52126758U JP S52126758 U JPS52126758 U JP S52126758U JP 1976034878 U JP1976034878 U JP 1976034878U JP 3487876 U JP3487876 U JP 3487876U JP S52126758 U JPS52126758 U JP S52126758U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976034878U JPS587645Y2 (ja) | 1976-03-23 | 1976-03-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976034878U JPS587645Y2 (ja) | 1976-03-23 | 1976-03-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52126758U true JPS52126758U (https=) | 1977-09-27 |
| JPS587645Y2 JPS587645Y2 (ja) | 1983-02-10 |
Family
ID=28494255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976034878U Expired JPS587645Y2 (ja) | 1976-03-23 | 1976-03-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS587645Y2 (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109332U (ja) * | 1983-12-27 | 1985-07-25 | 富士通株式会社 | 混成集積回路装置 |
| JPH02211655A (ja) * | 1989-02-10 | 1990-08-22 | Mitsubishi Electric Corp | 自動車用混成集積回路装置 |
| JPH0317016A (ja) * | 1989-05-19 | 1991-01-25 | F Hoffmann La Roche Ag | 神経系症状の処置剤 |
| JP2013084960A (ja) * | 2011-10-11 | 2013-05-09 | Led Engin Inc | はんだ接合のための溝付き板 |
-
1976
- 1976-03-23 JP JP1976034878U patent/JPS587645Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109332U (ja) * | 1983-12-27 | 1985-07-25 | 富士通株式会社 | 混成集積回路装置 |
| JPH02211655A (ja) * | 1989-02-10 | 1990-08-22 | Mitsubishi Electric Corp | 自動車用混成集積回路装置 |
| JPH0317016A (ja) * | 1989-05-19 | 1991-01-25 | F Hoffmann La Roche Ag | 神経系症状の処置剤 |
| JP2013084960A (ja) * | 2011-10-11 | 2013-05-09 | Led Engin Inc | はんだ接合のための溝付き板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS587645Y2 (ja) | 1983-02-10 |