JPS52101987A - Light emission diode - Google Patents

Light emission diode

Info

Publication number
JPS52101987A
JPS52101987A JP1921276A JP1921276A JPS52101987A JP S52101987 A JPS52101987 A JP S52101987A JP 1921276 A JP1921276 A JP 1921276A JP 1921276 A JP1921276 A JP 1921276A JP S52101987 A JPS52101987 A JP S52101987A
Authority
JP
Japan
Prior art keywords
light emission
emission diode
soldered
blackening
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1921276A
Other languages
Japanese (ja)
Other versions
JPS5830744B2 (en
Inventor
Kunihiko Takahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP51019212A priority Critical patent/JPS5830744B2/en
Publication of JPS52101987A publication Critical patent/JPS52101987A/en
Publication of JPS5830744B2 publication Critical patent/JPS5830744B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/14181—On opposite sides of the body

Abstract

PURPOSE: To prevent surface reflection and obtain clear display, by blackening a soldered surface, after light emission diode having planar electrodes parallel to p-n junction, has been soldered in a predetermined manner.
COPYRIGHT: (C)1977,JPO&Japio
JP51019212A 1976-02-20 1976-02-20 light emitting diode device Expired JPS5830744B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51019212A JPS5830744B2 (en) 1976-02-20 1976-02-20 light emitting diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51019212A JPS5830744B2 (en) 1976-02-20 1976-02-20 light emitting diode device

Publications (2)

Publication Number Publication Date
JPS52101987A true JPS52101987A (en) 1977-08-26
JPS5830744B2 JPS5830744B2 (en) 1983-07-01

Family

ID=11993052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51019212A Expired JPS5830744B2 (en) 1976-02-20 1976-02-20 light emitting diode device

Country Status (1)

Country Link
JP (1) JPS5830744B2 (en)

Also Published As

Publication number Publication date
JPS5830744B2 (en) 1983-07-01

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