JPS5197979A - - Google Patents

Info

Publication number
JPS5197979A
JPS5197979A JP51004554A JP455476A JPS5197979A JP S5197979 A JPS5197979 A JP S5197979A JP 51004554 A JP51004554 A JP 51004554A JP 455476 A JP455476 A JP 455476A JP S5197979 A JPS5197979 A JP S5197979A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51004554A
Other languages
Japanese (ja)
Other versions
JPS6031102B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5197979A publication Critical patent/JPS5197979A/ja
Publication of JPS6031102B2 publication Critical patent/JPS6031102B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W95/00—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP51004554A 1975-01-30 1976-01-16 集積回路パツケージおよびその製作方法 Expired JPS6031102B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US545387 1975-01-30
US05/545,387 US4025716A (en) 1975-01-30 1975-01-30 Dual in-line package with window frame

Publications (2)

Publication Number Publication Date
JPS5197979A true JPS5197979A (ref) 1976-08-28
JPS6031102B2 JPS6031102B2 (ja) 1985-07-20

Family

ID=24176007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51004554A Expired JPS6031102B2 (ja) 1975-01-30 1976-01-16 集積回路パツケージおよびその製作方法

Country Status (6)

Country Link
US (1) US4025716A (ref)
JP (1) JPS6031102B2 (ref)
BR (1) BR7600170A (ref)
FR (1) FR2299725A1 (ref)
GB (1) GB1499358A (ref)
IN (1) IN144904B (ref)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289050A (ja) * 2001-03-26 2002-10-04 Furukawa Electric Co Ltd:The 余長入り自己支持型ケーブル用引取り機
KR101103429B1 (ko) * 2009-03-20 2012-01-09 장영진 냉매관 이송장치

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4572924A (en) * 1983-05-18 1986-02-25 Spectrum Ceramics, Inc. Electronic enclosures having metal parts
JPS60208847A (ja) * 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 表面実装型ｉｃに内在する水分の排出方法
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4651415A (en) * 1985-03-22 1987-03-24 Diacon, Inc. Leaded chip carrier
US5106784A (en) * 1987-04-16 1992-04-21 Texas Instruments Incorporated Method of making a post molded cavity package with internal dam bar for integrated circuit
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US4990719A (en) * 1989-07-13 1991-02-05 Gte Products Corporation Hermetically sealed chip carrier with metal cover having pre-poured glass window
US5014418A (en) * 1989-07-13 1991-05-14 Gte Products Corporation Method of forming a two piece chip carrier
US5334874A (en) * 1991-09-13 1994-08-02 Metzler Richard A Electronic device package
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US6011294A (en) * 1996-04-08 2000-01-04 Eastman Kodak Company Low cost CCD packaging
SE517944C2 (sv) * 2000-04-06 2002-08-06 Ericsson Telefon Ab L M Förfarande och styrelement för fastsättning av ett mönsterkort på ett element
SE518778C2 (sv) * 2000-04-19 2002-11-19 Ericsson Telefon Ab L M Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
US20050093119A1 (en) * 2003-10-31 2005-05-05 Abounion Technology, Corp. Window type case for memory card
US9502269B2 (en) * 2014-04-03 2016-11-22 Bae Systems Information And Electronic Systems Integration Inc. Method and apparatus for cooling electonic components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435516A (en) * 1959-05-06 1969-04-01 Texas Instruments Inc Semiconductor structure fabrication
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3502786A (en) * 1967-06-14 1970-03-24 Milton Stoll Flat pack spacer of low thermal diffusivity
US3509430A (en) * 1968-01-31 1970-04-28 Micro Science Associates Mount for electronic component
US3495023A (en) * 1968-06-14 1970-02-10 Nat Beryllia Corp Flat pack having a beryllia base and an alumina ring
US3535486A (en) * 1968-07-16 1970-10-20 Lucas Industries Ltd Electrical printed circuit assemblies
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3793064A (en) * 1971-11-15 1974-02-19 Du Pont Product and process for cavity metallization of semiconductor packages
US3809797A (en) * 1971-11-16 1974-05-07 Du Pont Seal ring compositions and electronic packages made therewith

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289050A (ja) * 2001-03-26 2002-10-04 Furukawa Electric Co Ltd:The 余長入り自己支持型ケーブル用引取り機
KR101103429B1 (ko) * 2009-03-20 2012-01-09 장영진 냉매관 이송장치

Also Published As

Publication number Publication date
FR2299725B1 (ref) 1982-04-02
IN144904B (ref) 1978-07-22
BR7600170A (pt) 1976-08-31
GB1499358A (en) 1978-02-01
FR2299725A1 (fr) 1976-08-27
US4025716A (en) 1977-05-24
JPS6031102B2 (ja) 1985-07-20

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