JPS5190475A - - Google Patents
Info
- Publication number
- JPS5190475A JPS5190475A JP50015406A JP1540675A JPS5190475A JP S5190475 A JPS5190475 A JP S5190475A JP 50015406 A JP50015406 A JP 50015406A JP 1540675 A JP1540675 A JP 1540675A JP S5190475 A JPS5190475 A JP S5190475A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1540675A JPS574116B2 (enrdf_load_html_response) | 1975-02-07 | 1975-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1540675A JPS574116B2 (enrdf_load_html_response) | 1975-02-07 | 1975-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5190475A true JPS5190475A (enrdf_load_html_response) | 1976-08-07 |
| JPS574116B2 JPS574116B2 (enrdf_load_html_response) | 1982-01-25 |
Family
ID=11887838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1540675A Expired JPS574116B2 (enrdf_load_html_response) | 1975-02-07 | 1975-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS574116B2 (enrdf_load_html_response) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185771A (ja) * | 1983-04-07 | 1984-10-22 | Satoosen:Kk | めつき方法 |
| JPS617691A (ja) * | 1984-06-22 | 1986-01-14 | 日立コンデンサ株式会社 | プリント配線板の製造方法 |
| JPH08228068A (ja) * | 1995-02-22 | 1996-09-03 | Nec Corp | 無電解めっき用レジスト組成物 |
| WO2000016597A1 (en) * | 1998-09-14 | 2000-03-23 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
| WO2019111721A1 (ja) * | 2017-12-06 | 2019-06-13 | 東京エレクトロン株式会社 | めっき処理方法、めっき処理装置及び記憶媒体 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3606047B2 (ja) * | 1998-05-14 | 2005-01-05 | セイコーエプソン株式会社 | 基板の製造方法 |
| JP6616979B2 (ja) * | 2015-07-29 | 2019-12-04 | マクセルホールディングス株式会社 | メッキ部品の製造方法 |
-
1975
- 1975-02-07 JP JP1540675A patent/JPS574116B2/ja not_active Expired
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185771A (ja) * | 1983-04-07 | 1984-10-22 | Satoosen:Kk | めつき方法 |
| JPS617691A (ja) * | 1984-06-22 | 1986-01-14 | 日立コンデンサ株式会社 | プリント配線板の製造方法 |
| JPH08228068A (ja) * | 1995-02-22 | 1996-09-03 | Nec Corp | 無電解めっき用レジスト組成物 |
| WO2000016597A1 (en) * | 1998-09-14 | 2000-03-23 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
| US7230188B1 (en) | 1998-09-14 | 2007-06-12 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
| US7691189B2 (en) | 1998-09-14 | 2010-04-06 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
| US7827680B2 (en) | 1998-09-14 | 2010-11-09 | Ibiden Co., Ltd. | Electroplating process of electroplating an elecrically conductive sustrate |
| US8065794B2 (en) | 1998-09-14 | 2011-11-29 | Ibiden Co., Ltd. | Printed wiring board and its manufacturing method |
| WO2019111721A1 (ja) * | 2017-12-06 | 2019-06-13 | 東京エレクトロン株式会社 | めっき処理方法、めっき処理装置及び記憶媒体 |
| JPWO2019111721A1 (ja) * | 2017-12-06 | 2020-11-19 | 東京エレクトロン株式会社 | めっき処理方法、めっき処理装置及び記憶媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS574116B2 (enrdf_load_html_response) | 1982-01-25 |