JPS5187967A - Konseishusekikairokiban - Google Patents

Konseishusekikairokiban

Info

Publication number
JPS5187967A
JPS5187967A JP1256775A JP1256775A JPS5187967A JP S5187967 A JPS5187967 A JP S5187967A JP 1256775 A JP1256775 A JP 1256775A JP 1256775 A JP1256775 A JP 1256775A JP S5187967 A JPS5187967 A JP S5187967A
Authority
JP
Japan
Prior art keywords
konseishusekikairokiban
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1256775A
Other languages
English (en)
Inventor
Tatsuo Itagaki
Hiroshi Kato
Tasuku Unno
Keiji Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1256775A priority Critical patent/JPS5187967A/ja
Publication of JPS5187967A publication Critical patent/JPS5187967A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1256775A 1975-01-31 1975-01-31 Konseishusekikairokiban Pending JPS5187967A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1256775A JPS5187967A (ja) 1975-01-31 1975-01-31 Konseishusekikairokiban

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1256775A JPS5187967A (ja) 1975-01-31 1975-01-31 Konseishusekikairokiban

Publications (1)

Publication Number Publication Date
JPS5187967A true JPS5187967A (ja) 1976-07-31

Family

ID=11808920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1256775A Pending JPS5187967A (ja) 1975-01-31 1975-01-31 Konseishusekikairokiban

Country Status (1)

Country Link
JP (1) JPS5187967A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588346A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Packaging method for semiconductor element
JPS5649596A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Electronic device formed using insulating board and method of manufacturing same
JPS6116594A (ja) * 1985-06-21 1986-01-24 株式会社日立製作所 半導体装置
JP2008085228A (ja) * 2006-09-28 2008-04-10 Fujitsu Ltd プリント配線板、プリント配線板を有する電子装置、およびプリント配線板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588346A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Packaging method for semiconductor element
JPS5649596A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Electronic device formed using insulating board and method of manufacturing same
JPS6116594A (ja) * 1985-06-21 1986-01-24 株式会社日立製作所 半導体装置
JP2008085228A (ja) * 2006-09-28 2008-04-10 Fujitsu Ltd プリント配線板、プリント配線板を有する電子装置、およびプリント配線板の製造方法

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