JPS51103230A - Sairisutasutatsuku - Google Patents

Sairisutasutatsuku

Info

Publication number
JPS51103230A
JPS51103230A JP1184376A JP1184376A JPS51103230A JP S51103230 A JPS51103230 A JP S51103230A JP 1184376 A JP1184376 A JP 1184376A JP 1184376 A JP1184376 A JP 1184376A JP S51103230 A JPS51103230 A JP S51103230A
Authority
JP
Japan
Prior art keywords
sairisutasutatsuku
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1184376A
Other languages
English (en)
Other versions
JPS5640596B2 (ja
Inventor
Teiire Geruto
Ueeba Yurugen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS51103230A publication Critical patent/JPS51103230A/ja
Publication of JPS5640596B2 publication Critical patent/JPS5640596B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
JP1184376A 1975-02-05 1976-02-05 Sairisutasutatsuku Granted JPS51103230A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752504768 DE2504768A1 (de) 1975-02-05 1975-02-05 Thyristorsaeule

Publications (2)

Publication Number Publication Date
JPS51103230A true JPS51103230A (ja) 1976-09-11
JPS5640596B2 JPS5640596B2 (ja) 1981-09-21

Family

ID=5938139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1184376A Granted JPS51103230A (ja) 1975-02-05 1976-02-05 Sairisutasutatsuku

Country Status (2)

Country Link
JP (1) JPS51103230A (ja)
DE (1) DE2504768A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57108351U (ja) * 1980-12-23 1982-07-03
JPS599558U (ja) * 1982-07-12 1984-01-21 関西電力株式会社 半導体電力変換装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0057297A3 (de) * 1981-02-02 1982-08-25 BBC Aktiengesellschaft Brown, Boveri & Cie. Verspanneinrichtung zum Einspannen von scheibenförmigen Halbleiterelementen eines Stromrichters
SE441047B (sv) * 1983-10-06 1985-09-02 Asea Ab Halvledarventil for hogspenning med spenningsdelarsektioner innefattande motstand

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS517448U (ja) * 1974-07-03 1976-01-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS517448U (ja) * 1974-07-03 1976-01-20

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57108351U (ja) * 1980-12-23 1982-07-03
JPS599558U (ja) * 1982-07-12 1984-01-21 関西電力株式会社 半導体電力変換装置

Also Published As

Publication number Publication date
JPS5640596B2 (ja) 1981-09-21
DE2504768A1 (de) 1976-08-19

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