JPS5640596B2 - - Google Patents
Info
- Publication number
- JPS5640596B2 JPS5640596B2 JP1184376A JP1184376A JPS5640596B2 JP S5640596 B2 JPS5640596 B2 JP S5640596B2 JP 1184376 A JP1184376 A JP 1184376A JP 1184376 A JP1184376 A JP 1184376A JP S5640596 B2 JPS5640596 B2 JP S5640596B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
- Power Conversion In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752504768 DE2504768A1 (de) | 1975-02-05 | 1975-02-05 | Thyristorsaeule |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51103230A JPS51103230A (ja) | 1976-09-11 |
JPS5640596B2 true JPS5640596B2 (ja) | 1981-09-21 |
Family
ID=5938139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1184376A Granted JPS51103230A (ja) | 1975-02-05 | 1976-02-05 | Sairisutasutatsuku |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS51103230A (ja) |
DE (1) | DE2504768A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57108351U (ja) * | 1980-12-23 | 1982-07-03 | ||
EP0057297A3 (de) * | 1981-02-02 | 1982-08-25 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Verspanneinrichtung zum Einspannen von scheibenförmigen Halbleiterelementen eines Stromrichters |
JPS599558U (ja) * | 1982-07-12 | 1984-01-21 | 関西電力株式会社 | 半導体電力変換装置 |
SE441047B (sv) * | 1983-10-06 | 1985-09-02 | Asea Ab | Halvledarventil for hogspenning med spenningsdelarsektioner innefattande motstand |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS517448U (ja) * | 1974-07-03 | 1976-01-20 |
-
1975
- 1975-02-05 DE DE19752504768 patent/DE2504768A1/de active Pending
-
1976
- 1976-02-05 JP JP1184376A patent/JPS51103230A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS517448U (ja) * | 1974-07-03 | 1976-01-20 |
Also Published As
Publication number | Publication date |
---|---|
DE2504768A1 (de) | 1976-08-19 |
JPS51103230A (ja) | 1976-09-11 |