JPS5175380A - - Google Patents

Info

Publication number
JPS5175380A
JPS5175380A JP50119015A JP11901575A JPS5175380A JP S5175380 A JPS5175380 A JP S5175380A JP 50119015 A JP50119015 A JP 50119015A JP 11901575 A JP11901575 A JP 11901575A JP S5175380 A JPS5175380 A JP S5175380A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50119015A
Other versions
JPS5818360B2 (ja
Inventor
Aaru Santeiro Junia Jooji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5175380A publication Critical patent/JPS5175380A/ja
Publication of JPS5818360B2 publication Critical patent/JPS5818360B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338—Etching
    • C04B41/5353—Wet etching, e.g. with etchants dissolved in organic solvents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Weting (AREA)
JP50119015A 1974-12-16 1975-10-03 結晶ブ−ルを切断する方法 Expired JPS5818360B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US533036A US3915770A (en) 1974-12-16 1974-12-16 Method and apparatus for thermo-chemically slicing crystal boules

Publications (2)

Publication Number Publication Date
JPS5175380A true JPS5175380A (ja) 1976-06-29
JPS5818360B2 JPS5818360B2 (ja) 1983-04-12

Family

ID=24124196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50119015A Expired JPS5818360B2 (ja) 1974-12-16 1975-10-03 結晶ブ−ルを切断する方法

Country Status (5)

Country Link
US (1) US3915770A (ja)
JP (1) JPS5818360B2 (ja)
DE (1) DE2548329C2 (ja)
FR (1) FR2294816A1 (ja)
GB (1) GB1452976A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014070277A (ja) * 2012-09-27 2014-04-21 Nippon Seisen Co Ltd エッチングカット用ワイヤー及びこれを用いた無機性脆性材料のカット方法
JP2017008420A (ja) * 2016-07-28 2017-01-12 日本精線株式会社 エッチングカット用ワイヤーの製造方法及びこの方法で得られたエッチングカット用ワイヤーを用いた無機性脆性材料のカット方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4343662A (en) * 1981-03-31 1982-08-10 Atlantic Richfield Company Manufacturing semiconductor wafer devices by simultaneous slicing and etching
US4465550A (en) * 1982-06-16 1984-08-14 General Signal Corporation Method and apparatus for slicing semiconductor ingots
US5203961A (en) * 1991-09-20 1993-04-20 Yen Yung Tsai Wet die cutter assembly and method
DE10014445C2 (de) * 2000-03-23 2002-01-24 Wacker Siltronic Halbleitermat Verfahren zum Zerteilen eines Halbleiterstabes
US20060027542A1 (en) * 2004-04-28 2006-02-09 Niraj Mahadev Method to eliminate defects on the periphery of a slider due to conventional machining processes
DE102006019461A1 (de) * 2006-04-26 2007-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ätzverfahren zum Materialabtrag an Festkörpern und dessen Verwendung sowie Vorrichtung hierzu

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2144370A (en) * 1936-07-10 1939-01-17 Telefunken Gmbh Method of cutting bodies soluble in liquid
US2933437A (en) * 1956-05-29 1960-04-19 Bell Telephone Labor Inc Chemical lapping method
US3039235A (en) * 1961-01-31 1962-06-19 Hamco Mach & Elect Co Cutting apparatus
US3241265A (en) * 1963-06-27 1966-03-22 Ibm Bombardment cutter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014070277A (ja) * 2012-09-27 2014-04-21 Nippon Seisen Co Ltd エッチングカット用ワイヤー及びこれを用いた無機性脆性材料のカット方法
JP2017008420A (ja) * 2016-07-28 2017-01-12 日本精線株式会社 エッチングカット用ワイヤーの製造方法及びこの方法で得られたエッチングカット用ワイヤーを用いた無機性脆性材料のカット方法

Also Published As

Publication number Publication date
GB1452976A (en) 1976-10-20
DE2548329C2 (de) 1985-03-14
JPS5818360B2 (ja) 1983-04-12
FR2294816A1 (fr) 1976-07-16
FR2294816B1 (ja) 1979-04-06
DE2548329A1 (de) 1976-07-01
US3915770A (en) 1975-10-28

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