JPS5168179A - - Google Patents

Info

Publication number
JPS5168179A
JPS5168179A JP13058475A JP13058475A JPS5168179A JP S5168179 A JPS5168179 A JP S5168179A JP 13058475 A JP13058475 A JP 13058475A JP 13058475 A JP13058475 A JP 13058475A JP S5168179 A JPS5168179 A JP S5168179A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13058475A
Other languages
Japanese (ja)
Inventor
Kuun Mashuu
Edoin Shumeekaa Nooman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of JPS5168179A publication Critical patent/JPS5168179A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W99/00
    • H10W90/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4685Manufacturing of cross-over conductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/853Encapsulations characterised by their shape

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP13058475A 1974-10-31 1975-10-31 Pending JPS5168179A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/519,594 US3964157A (en) 1974-10-31 1974-10-31 Method of mounting semiconductor chips

Publications (1)

Publication Number Publication Date
JPS5168179A true JPS5168179A (enExample) 1976-06-12

Family

ID=24068969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13058475A Pending JPS5168179A (enExample) 1974-10-31 1975-10-31

Country Status (6)

Country Link
US (1) US3964157A (enExample)
JP (1) JPS5168179A (enExample)
CA (1) CA1026873A (enExample)
DE (1) DE2548122A1 (enExample)
FR (1) FR2290036A1 (enExample)
GB (1) GB1526283A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5789276A (en) * 1980-11-26 1982-06-03 Alps Electric Co Ltd Photo chip element

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429239B2 (enExample) * 1974-12-04 1979-09-21
GB1597712A (en) * 1977-01-17 1981-09-09 Plessey Co Ltd Display devices
US4110661A (en) * 1977-04-01 1978-08-29 Rockwell International Corporation Light emitting device for optical communications
GB2192753A (en) * 1986-07-02 1988-01-20 Mitutoyo Corp Light emitting diode device
JPS63192280A (ja) * 1987-02-04 1988-08-09 Mitsubishi Electric Corp 端面発光型半導体装置の製造方法
JPH0834264B2 (ja) * 1987-04-21 1996-03-29 住友電気工業株式会社 半導体装置およびその製造方法
US5187547A (en) * 1988-05-18 1993-02-16 Sanyo Electric Co., Ltd. Light emitting diode device and method for producing same
KR910006706B1 (ko) * 1988-12-12 1991-08-31 삼성전자 주식회사 발광다이오드 어레이 헤드의 제조방법
US4966862A (en) * 1989-08-28 1990-10-30 Cree Research, Inc. Method of production of light emitting diodes
US5055892A (en) * 1989-08-29 1991-10-08 Hewlett-Packard Company High efficiency lamp or light accepter
US5102824A (en) * 1990-11-05 1992-04-07 California Institute Of Technology Method of manufacturing a distributed light emitting diode flat-screen display for use in televisions
US5149958A (en) * 1990-12-12 1992-09-22 Eastman Kodak Company Optoelectronic device component package
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
US5569880A (en) * 1994-12-02 1996-10-29 Avx Corporation Surface mountable electronic component and method of making same
US5798536A (en) * 1996-01-25 1998-08-25 Rohm Co., Ltd. Light-emitting semiconductor device and method for manufacturing the same
US7064355B2 (en) * 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US7053419B1 (en) 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP2002141556A (ja) 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
US20080203911A1 (en) * 2005-04-29 2008-08-28 Koninklijke Philips Electronics N.V. Light Source With Glass Housing
US20070158796A1 (en) * 2005-12-09 2007-07-12 International Rectifier Corporation Semiconductor package
US9894781B2 (en) 2012-06-06 2018-02-13 Apple Inc. Notched display layers
US11152553B2 (en) * 2019-01-15 2021-10-19 Seoul Viosys Co., Ltd. Light emitting device package and display device having the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1180067C2 (de) * 1961-03-17 1970-03-12 Elektronik M B H Verfahren zum gleichzeitigen Kontaktieren mehrerer Halbleiteranordnungen
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
FR1483570A (enExample) * 1965-06-23 1967-09-06
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
DE1915501C3 (de) * 1969-03-26 1975-10-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
US3694902A (en) * 1970-08-31 1972-10-03 Bell Telephone Labor Inc Electroluminescent display apparatus
JPS5422115B2 (enExample) * 1972-05-19 1979-08-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5789276A (en) * 1980-11-26 1982-06-03 Alps Electric Co Ltd Photo chip element

Also Published As

Publication number Publication date
US3964157A (en) 1976-06-22
DE2548122A1 (de) 1976-05-13
FR2290036A1 (fr) 1976-05-28
CA1026873A (en) 1978-02-21
FR2290036B1 (enExample) 1979-07-06
GB1526283A (en) 1978-09-27

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