JPS5160449A - Denshibuhin - Google Patents
DenshibuhinInfo
- Publication number
- JPS5160449A JPS5160449A JP13430174A JP13430174A JPS5160449A JP S5160449 A JPS5160449 A JP S5160449A JP 13430174 A JP13430174 A JP 13430174A JP 13430174 A JP13430174 A JP 13430174A JP S5160449 A JPS5160449 A JP S5160449A
- Authority
- JP
- Japan
- Prior art keywords
- denshibuhin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13430174A JPS5160449A (ja) | 1974-11-25 | 1974-11-25 | Denshibuhin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13430174A JPS5160449A (ja) | 1974-11-25 | 1974-11-25 | Denshibuhin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5160449A true JPS5160449A (ja) | 1976-05-26 |
JPS537788B2 JPS537788B2 (ja) | 1978-03-22 |
Family
ID=15125073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13430174A Granted JPS5160449A (ja) | 1974-11-25 | 1974-11-25 | Denshibuhin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5160449A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556867A (en) * | 1978-06-29 | 1980-01-18 | Nec Corp | Vessel for semiconductor device |
JPS58209147A (ja) * | 1982-05-31 | 1983-12-06 | Toshiba Corp | 樹脂封止型半導体装置 |
WO2020039466A1 (ja) * | 2018-08-20 | 2020-02-27 | 三菱電機株式会社 | 半導体モジュール |
-
1974
- 1974-11-25 JP JP13430174A patent/JPS5160449A/ja active Granted
Non-Patent Citations (1)
Title |
---|
12TH ANNUAL PROCEEDINGS RELIABILITY PHYSICS=1974US * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556867A (en) * | 1978-06-29 | 1980-01-18 | Nec Corp | Vessel for semiconductor device |
JPS58209147A (ja) * | 1982-05-31 | 1983-12-06 | Toshiba Corp | 樹脂封止型半導体装置 |
JPH0227815B2 (ja) * | 1982-05-31 | 1990-06-20 | Tokyo Shibaura Electric Co | |
WO2020039466A1 (ja) * | 2018-08-20 | 2020-02-27 | 三菱電機株式会社 | 半導体モジュール |
JPWO2020039466A1 (ja) * | 2018-08-20 | 2021-06-03 | 三菱電機株式会社 | 半導体モジュール |
US11621216B2 (en) | 2018-08-20 | 2023-04-04 | Mitsubishi Electric Corporation | Semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
JPS537788B2 (ja) | 1978-03-22 |
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