JPS5153476A - Hokyosaretayugamiteikoojusurueefuajoshohenyokago - Google Patents

Hokyosaretayugamiteikoojusurueefuajoshohenyokago

Info

Publication number
JPS5153476A
JPS5153476A JP50109905A JP10990575A JPS5153476A JP S5153476 A JPS5153476 A JP S5153476A JP 50109905 A JP50109905 A JP 50109905A JP 10990575 A JP10990575 A JP 10990575A JP S5153476 A JPS5153476 A JP S5153476A
Authority
JP
Japan
Prior art keywords
hokyosaretayugamiteikoojusurueefuajoshohenyokago
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50109905A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5410429B2 (enrdf_load_stackoverflow
Inventor
Maachin Jonson Dagurasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUOROEA Inc
Original Assignee
FURUOROEA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUOROEA Inc filed Critical FURUOROEA Inc
Publication of JPS5153476A publication Critical patent/JPS5153476A/ja
Publication of JPS5410429B2 publication Critical patent/JPS5410429B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Packaging Frangible Articles (AREA)
JP50109905A 1974-09-11 1975-09-10 Hokyosaretayugamiteikoojusurueefuajoshohenyokago Granted JPS5153476A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/504,904 US3961877A (en) 1974-09-11 1974-09-11 Reinforced wafer basket

Publications (2)

Publication Number Publication Date
JPS5153476A true JPS5153476A (en) 1976-05-11
JPS5410429B2 JPS5410429B2 (enrdf_load_stackoverflow) 1979-05-07

Family

ID=24008195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50109905A Granted JPS5153476A (en) 1974-09-11 1975-09-10 Hokyosaretayugamiteikoojusurueefuajoshohenyokago

Country Status (2)

Country Link
US (1) US3961877A (enrdf_load_stackoverflow)
JP (1) JPS5153476A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300417A (en) * 1991-06-25 1994-04-05 Eastman Kodak Company Photographic element containing stress absorbing protective layer

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4023691A (en) * 1975-09-15 1977-05-17 United States Fused Quartz Company, Inc. Method of transferring semi-conductor discs by a hinged transfer carrier
US4129211A (en) * 1976-09-07 1978-12-12 Monsanto Company Wafer packaging system
DE2702464C2 (de) * 1977-01-21 1981-10-15 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verpackung von Halbleiterscheiben
US4197000A (en) * 1978-05-23 1980-04-08 Fsi Corporation Positive developing method and apparatus
US4286541A (en) * 1979-07-26 1981-09-01 Fsi Corporation Applying photoresist onto silicon wafers
US4471716A (en) * 1981-01-15 1984-09-18 Fluoroware, Inc. Wafer carrier
US4450960A (en) * 1982-08-30 1984-05-29 Empak Inc. Package
US4493418A (en) * 1983-08-17 1985-01-15 Empak Inc. Wafer processing cassette
US4557382A (en) * 1983-08-17 1985-12-10 Empak Inc. Disk package
USRE33361E (en) * 1984-06-07 1990-10-02 Substrate and media carrier
US4588086A (en) * 1984-06-07 1986-05-13 Coe Thomas U Substrate and media carrier
DE3440111C1 (de) * 1984-11-02 1986-05-15 Heraeus Quarzschmelze Gmbh, 6450 Hanau Traegerhorde
US4687097A (en) * 1984-12-11 1987-08-18 Empak, Inc. Wafer processing cassette
US4724963A (en) * 1985-02-20 1988-02-16 Empak, Inc. Wafer processing cassette
US4669612A (en) * 1985-02-20 1987-06-02 Empak Inc. Disk processing cassette
US4658960A (en) * 1985-10-07 1987-04-21 Iwasa Nob T Color coding cassette
US4817799A (en) * 1986-10-06 1989-04-04 Empak, Inc. Disk package
US4815601A (en) * 1987-09-29 1989-03-28 Fluoroware, Inc. Carrier for flat panel displays
US4930634A (en) * 1987-09-29 1990-06-05 Fluoroware, Inc. Carrier for flat panel displays
US4949848A (en) * 1988-04-29 1990-08-21 Fluoroware, Inc. Wafer carrier
USD323173S (en) 1988-07-25 1992-01-14 Tel Sagami Limited Instrument for transferring boats for thermal treatment of semiconductor wafers
US4900395A (en) * 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
US5149244A (en) * 1989-08-18 1992-09-22 Applied Materials, Inc. Apparatus for aligning wafers within a semiconductor wafer cassette
US5217341A (en) * 1989-08-18 1993-06-08 Applied Materials, Inc. Method for aligning wafers within a semiconductor wafer cassette
US5111936A (en) * 1990-11-30 1992-05-12 Fluoroware Wafer carrier
US5110001A (en) * 1991-03-04 1992-05-05 Micron Technology, Inc. Handle for wafer carrier
US5123681A (en) * 1991-03-20 1992-06-23 Fluoroware, Inc. Latch for wafer storage box for manual or robot operation
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
US5472086A (en) * 1994-03-11 1995-12-05 Holliday; James E. Enclosed sealable purgible semiconductor wafer holder
US5476176A (en) * 1994-05-23 1995-12-19 Empak, Inc. Reinforced semiconductor wafer holder
USD368802S (en) 1994-10-13 1996-04-16 Gallagher Gary M 150 mm wafer cassette for use on 200 mm semi standard wafer handling equipment
JP3230819B2 (ja) * 1997-01-21 2001-11-19 横浜ゴム株式会社 一液型常温湿気硬化性樹脂組成物
US6520191B1 (en) 1998-10-19 2003-02-18 Memc Electronic Materials, Inc. Carrier for cleaning silicon wafers
US6758339B2 (en) * 2001-07-12 2004-07-06 Entegris, Inc. Thin wafer carrier
TW522448B (en) * 2001-10-22 2003-03-01 Advanced Semiconductor Eng Semiconductor wafer carrying apparatus
US7175026B2 (en) * 2002-05-03 2007-02-13 Maxtor Corporation Memory disk shipping container with improved contaminant control
KR100655431B1 (ko) * 2005-03-23 2006-12-11 삼성전자주식회사 웨이퍼와의 접촉 면적을 최소화할 수 있는 웨이퍼 캐리어 및 이를 이용한 웨이퍼 세정방법
JP4999808B2 (ja) * 2008-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置
JP7450646B2 (ja) * 2020-02-07 2024-03-15 京セラ株式会社 ウェハーボート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS478166U (enrdf_load_stackoverflow) * 1971-02-18 1972-09-29
JPS4952599A (enrdf_load_stackoverflow) * 1972-09-20 1974-05-22

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1885691A (en) * 1928-04-24 1932-11-01 New Castle Refractories Compan Ware support
CH471013A (de) * 1967-03-15 1969-04-15 Ebauches Sa Halter für mit Flansch versehene Packungen
US3486631A (en) * 1967-09-29 1969-12-30 John T Shaler Co Basket for polished wafers
US3473670A (en) * 1968-01-30 1969-10-21 Fluoroware Inc Article supporting basket
US3467242A (en) * 1968-03-04 1969-09-16 Dale E De Rousse Storage unit for wafer-like articles
US3534862A (en) * 1968-09-13 1970-10-20 Rca Corp Semiconductor wafer transporting jig
DE2133843A1 (de) * 1971-07-07 1973-01-18 Siemens Ag Anordnung zum eindiffundieren von dotierstoffen in halbleiterscheiben
US3701558A (en) * 1971-07-19 1972-10-31 Fluoroware Inc Detachable handle for receptacle
US3850296A (en) * 1971-07-21 1974-11-26 Shinetsu Handotai Kk Device and method for accommodating semiconductor wafers
US3737282A (en) * 1971-10-01 1973-06-05 Ibm Method for reducing crystallographic defects in semiconductor structures
US3819076A (en) * 1971-10-20 1974-06-25 C Oehler Special pallet type load transport apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS478166U (enrdf_load_stackoverflow) * 1971-02-18 1972-09-29
JPS4952599A (enrdf_load_stackoverflow) * 1972-09-20 1974-05-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300417A (en) * 1991-06-25 1994-04-05 Eastman Kodak Company Photographic element containing stress absorbing protective layer

Also Published As

Publication number Publication date
JPS5410429B2 (enrdf_load_stackoverflow) 1979-05-07
US3961877B1 (enrdf_load_stackoverflow) 1987-11-03
US3961877A (en) 1976-06-08

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