JPS5144872B2 - - Google Patents
Info
- Publication number
- JPS5144872B2 JPS5144872B2 JP8739971A JP8739971A JPS5144872B2 JP S5144872 B2 JPS5144872 B2 JP S5144872B2 JP 8739971 A JP8739971 A JP 8739971A JP 8739971 A JP8739971 A JP 8739971A JP S5144872 B2 JPS5144872 B2 JP S5144872B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8739971A JPS5144872B2 (ja) | 1971-11-02 | 1971-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8739971A JPS5144872B2 (ja) | 1971-11-02 | 1971-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4852486A JPS4852486A (ja) | 1973-07-23 |
| JPS5144872B2 true JPS5144872B2 (ja) | 1976-12-01 |
Family
ID=13913781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8739971A Expired JPS5144872B2 (ja) | 1971-11-02 | 1971-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5144872B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57148733U (ja) * | 1981-03-13 | 1982-09-18 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5067594A (ja) * | 1973-10-15 | 1975-06-06 | ||
| JPS5915495B2 (ja) * | 1974-10-04 | 1984-04-10 | 日本電気株式会社 | 半導体装置 |
| JPS5815944B2 (ja) * | 1974-10-08 | 1983-03-28 | 日本電気株式会社 | 半導体装置 |
| JPS6027187B2 (ja) * | 1975-04-18 | 1985-06-27 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| JPS5950113B2 (ja) * | 1975-11-05 | 1984-12-06 | 株式会社東芝 | 半導体装置 |
| US4075756A (en) * | 1976-06-30 | 1978-02-28 | International Business Machines Corporation | Process for fabricating above and below ground plane wiring on one side of a supporting substrate and the resulting circuit configuration |
| JPS5321586A (en) * | 1976-08-12 | 1978-02-28 | Mitsubishi Electric Corp | Production of semiconductor device |
| JPS57101714A (en) * | 1980-12-17 | 1982-06-24 | Matsushita Electric Ind Co Ltd | Measuring method for film thickness |
| US4442449A (en) * | 1981-03-16 | 1984-04-10 | Fairchild Camera And Instrument Corp. | Binary germanium-silicon interconnect and electrode structure for integrated circuits |
-
1971
- 1971-11-02 JP JP8739971A patent/JPS5144872B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57148733U (ja) * | 1981-03-13 | 1982-09-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4852486A (ja) | 1973-07-23 |