JPS5140773A - Handotaidebaisuno seizohoho - Google Patents

Handotaidebaisuno seizohoho

Info

Publication number
JPS5140773A
JPS5140773A JP50091009A JP9100975A JPS5140773A JP S5140773 A JPS5140773 A JP S5140773A JP 50091009 A JP50091009 A JP 50091009A JP 9100975 A JP9100975 A JP 9100975A JP S5140773 A JPS5140773 A JP S5140773A
Authority
JP
Japan
Prior art keywords
handotaidebaisuno
seizohoho
handotaidebaisuno seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50091009A
Other languages
English (en)
Japanese (ja)
Inventor
Gurauru Yurugen
Muruman Herumuuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19742435905 external-priority patent/DE2435905C3/de
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5140773A publication Critical patent/JPS5140773A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/40Vertical BJTs
    • H10D10/441Vertical BJTs having an emitter-base junction ending at a main surface of the body and a base-collector junction ending at a lateral surface of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31105Etching inorganic layers
    • H01L21/31111Etching inorganic layers by chemical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Bipolar Transistors (AREA)
JP50091009A 1974-07-25 1975-07-25 Handotaidebaisuno seizohoho Pending JPS5140773A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742435905 DE2435905C3 (de) 1974-07-25 Verfahren zum Herstellen einer Halbleiteranordnung

Publications (1)

Publication Number Publication Date
JPS5140773A true JPS5140773A (en) 1976-04-05

Family

ID=5921549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50091009A Pending JPS5140773A (en) 1974-07-25 1975-07-25 Handotaidebaisuno seizohoho

Country Status (6)

Country Link
US (1) US3963524A (cg-RX-API-DMAC7.html)
JP (1) JPS5140773A (cg-RX-API-DMAC7.html)
CA (1) CA1070028A (cg-RX-API-DMAC7.html)
FR (1) FR2280201A1 (cg-RX-API-DMAC7.html)
GB (1) GB1492447A (cg-RX-API-DMAC7.html)
IT (1) IT1039921B (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339061A (en) * 1976-09-22 1978-04-10 Nec Corp Production of semiconductor device
JPS5367383A (en) * 1976-08-08 1978-06-15 Fairchild Camera Instr Co Method of producing small ic implantation logic semiconductor
WO1980002623A1 (fr) * 1979-05-18 1980-11-27 Fujitsu Ltd Procede de preparation d'un dispositif a semi-conducteur
JPS58108737A (ja) * 1982-11-15 1983-06-28 Nec Corp 半導体装置の製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4143455A (en) * 1976-03-11 1979-03-13 Siemens Aktiengesellschaft Method of producing a semiconductor component
US4135954A (en) * 1977-07-12 1979-01-23 International Business Machines Corporation Method for fabricating self-aligned semiconductor devices utilizing selectively etchable masking layers
US4233934A (en) * 1978-12-07 1980-11-18 General Electric Company Guard ring for TGZM processing
JPS58127374A (ja) * 1982-01-25 1983-07-29 Hitachi Ltd 半導体装置の製造方法
IT1231913B (it) * 1987-10-23 1992-01-15 Sgs Microelettronica Spa Procedimento di fabbricazione di transistori ad alta frequenza.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979768A (en) * 1966-03-23 1976-09-07 Hitachi, Ltd. Semiconductor element having surface coating comprising silicon nitride and silicon oxide films
BE759667A (fr) * 1969-12-01 1971-06-01 Philips Nv Procede permettant la fabrication d'un dispositif semiconducteur, et dispositif semiconducteur obtenu par la mise en oeuvre de ce procede
GB1332932A (en) * 1970-01-15 1973-10-10 Mullard Ltd Methods of manufacturing a semiconductor device
US3756861A (en) * 1972-03-13 1973-09-04 Bell Telephone Labor Inc Bipolar transistors and method of manufacture
US3793088A (en) * 1972-11-15 1974-02-19 Bell Telephone Labor Inc Compatible pnp and npn devices in an integrated circuit
US3898105A (en) * 1973-10-25 1975-08-05 Mostek Corp Method for making FET circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5367383A (en) * 1976-08-08 1978-06-15 Fairchild Camera Instr Co Method of producing small ic implantation logic semiconductor
JPS5339061A (en) * 1976-09-22 1978-04-10 Nec Corp Production of semiconductor device
WO1980002623A1 (fr) * 1979-05-18 1980-11-27 Fujitsu Ltd Procede de preparation d'un dispositif a semi-conducteur
JPS58108737A (ja) * 1982-11-15 1983-06-28 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
DE2435905A1 (de) 1976-02-05
FR2280201B1 (cg-RX-API-DMAC7.html) 1983-03-18
US3963524A (en) 1976-06-15
GB1492447A (en) 1977-11-16
DE2435905B2 (de) 1976-08-26
FR2280201A1 (fr) 1976-02-20
IT1039921B (it) 1979-12-10
CA1070028A (en) 1980-01-15

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