JPS5137094B2 - - Google Patents
Info
- Publication number
- JPS5137094B2 JPS5137094B2 JP6042072A JP6042072A JPS5137094B2 JP S5137094 B2 JPS5137094 B2 JP S5137094B2 JP 6042072 A JP6042072 A JP 6042072A JP 6042072 A JP6042072 A JP 6042072A JP S5137094 B2 JPS5137094 B2 JP S5137094B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6042072A JPS5137094B2 (en:Method) | 1972-06-19 | 1972-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6042072A JPS5137094B2 (en:Method) | 1972-06-19 | 1972-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4920239A JPS4920239A (en:Method) | 1974-02-22 |
| JPS5137094B2 true JPS5137094B2 (en:Method) | 1976-10-13 |
Family
ID=13141682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6042072A Expired JPS5137094B2 (en:Method) | 1972-06-19 | 1972-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5137094B2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567795U (en:Method) * | 1978-11-02 | 1980-05-09 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190423U (en:Method) * | 1981-05-29 | 1982-12-02 | ||
| JPH0349943A (ja) * | 1989-07-18 | 1991-03-04 | Konica Corp | 積層体 |
| JP2001031940A (ja) * | 1999-07-19 | 2001-02-06 | Toyobo Co Ltd | 接着剤組成物 |
| JP5151003B2 (ja) * | 2004-11-10 | 2013-02-27 | 東洋紡株式会社 | 接着剤およびそれを用いた回路基板 |
| JP5256754B2 (ja) * | 2008-02-01 | 2013-08-07 | 東レ株式会社 | 積層フィルム |
| CN110268030B (zh) * | 2017-03-28 | 2021-12-28 | 东洋纺株式会社 | 含有羧酸基的聚酯系粘合剂组合物 |
-
1972
- 1972-06-19 JP JP6042072A patent/JPS5137094B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567795U (en:Method) * | 1978-11-02 | 1980-05-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4920239A (en:Method) | 1974-02-22 |