JPS5136877B1 - - Google Patents

Info

Publication number
JPS5136877B1
JPS5136877B1 JP47011445A JP1144572A JPS5136877B1 JP S5136877 B1 JPS5136877 B1 JP S5136877B1 JP 47011445 A JP47011445 A JP 47011445A JP 1144572 A JP1144572 A JP 1144572A JP S5136877 B1 JPS5136877 B1 JP S5136877B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47011445A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5136877B1 publication Critical patent/JPS5136877B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/15Silicon on sapphire SOS
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851Intermediate layer is discontinuous or differential
    • Y10T428/24868Translucent outer layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909Free metal or mineral containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Adjustable Resistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP47011445A 1971-02-02 1972-02-02 Pending JPS5136877B1 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11189771A 1971-02-02 1971-02-02

Publications (1)

Publication Number Publication Date
JPS5136877B1 true JPS5136877B1 (cg-RX-API-DMAC10.html) 1976-10-12

Family

ID=22341025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47011445A Pending JPS5136877B1 (cg-RX-API-DMAC10.html) 1971-02-02 1972-02-02

Country Status (6)

Country Link
US (1) US4088799A (cg-RX-API-DMAC10.html)
JP (1) JPS5136877B1 (cg-RX-API-DMAC10.html)
FR (1) FR2124361B1 (cg-RX-API-DMAC10.html)
GB (1) GB1346517A (cg-RX-API-DMAC10.html)
IL (1) IL38468A (cg-RX-API-DMAC10.html)
IT (1) IT948212B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016509246A (ja) * 2012-12-11 2016-03-24 ジーティーエイティー コーポレーションGtat Corporation 改質サファイアを含有してなる携帯用電子機器

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US4188417A (en) * 1977-05-04 1980-02-12 Balzers Patent-und Beteiligungs-Aktiegesellschaft Method of applying a dielectric layer to a substrate and a mask-forming coating for the application of a dielectric layer
US4173660A (en) * 1977-07-27 1979-11-06 The United States Of America As Represented By The United States Department Of Energy Method of preparing a thermoluminescent phosphor
US4196228A (en) * 1978-06-10 1980-04-01 Monolithic Memories, Inc. Fabrication of high resistivity semiconductor resistors by ion implanatation
JPS5839376B2 (ja) * 1978-10-30 1983-08-30 富士通株式会社 イオン注入法
US4286250A (en) * 1979-05-04 1981-08-25 New England Instrument Company Laser formed resistor elements
DE3041957A1 (de) * 1979-11-08 1981-09-03 British Aerospace, Weybridge, Surrey Thermische abschirmung, insbesondere fuer raumfahrzeuge
US4532149A (en) * 1981-10-21 1985-07-30 The United States Of America As Represented By The United States Department Of Energy Method for producing hard-surfaced tools and machine components
GB8310298D0 (en) * 1983-04-15 1983-05-18 Atomic Energy Authority Uk Modification of surface properties of ceramics
US4489104A (en) * 1983-06-03 1984-12-18 Industrial Technology Research Institute Polycrystalline silicon resistor having limited lateral diffusion
US4560583A (en) * 1984-06-29 1985-12-24 International Business Machines Corporation Resistor design system
US4800170A (en) * 1987-10-02 1989-01-24 General Motors Corporation Process for forming in a silicon oxide layer a portion with vertical side walls
US5132248A (en) * 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
US4915746A (en) * 1988-08-15 1990-04-10 Welsch Gerhard E Method of forming high temperature barriers in structural metals to make such metals creep resistant at high homologous temperatures
JP2764591B2 (ja) * 1988-12-16 1998-06-11 株式会社小松製作所 薄膜el素子とその製造方法
JP2934456B2 (ja) * 1989-07-14 1999-08-16 株式会社日立製作所 表面処理方法及びその装置
US5164266A (en) * 1989-10-24 1992-11-17 Isuzu Ceramics Research Institute Co., Ltd. Slidable ceramic member and method of manufacturing same
US5183795A (en) * 1989-12-13 1993-02-02 Intel Corporation Fully planar metalization process
US5060110A (en) * 1990-08-29 1991-10-22 Motorola, Inc. High frequency MOSCAP
FR2695117B1 (fr) * 1992-08-28 1994-12-02 Saint Gobain Vitrage Int Procédé de traitement de couches minces à propriétés de conduction électrique et/ou de réflexion dans l'infra-rouge.
US5437729A (en) * 1993-04-08 1995-08-01 Martin Marietta Energy Systems, Inc. Controlled removal of ceramic surfaces with combination of ions implantation and ultrasonic energy
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US5665899A (en) * 1996-02-23 1997-09-09 Rosemount Inc. Pressure sensor diagnostics in a process transmitter
US5808205A (en) * 1997-04-01 1998-09-15 Rosemount Inc. Eccentric capacitive pressure sensor
US6017829A (en) 1997-04-01 2000-01-25 Micron Technology, Inc. Implanted conductor and methods of making
US6451674B1 (en) 1998-02-18 2002-09-17 Matsushita Electronics Corporation Method for introducing impurity into a semiconductor substrate without negative charge buildup phenomenon
US6403454B1 (en) * 1999-10-29 2002-06-11 Agere Systems Guardian Corp. Silicon semiconductor devices with δ-doped layers
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
DE60108217T2 (de) 2000-01-06 2005-12-29 Rosemount Inc., Eden Prairie Kornwachstumsverfahren zur herstellung einer elektrischen verbindung für mikroelektromechanische systeme (mems)
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
IL143442A0 (en) * 2001-05-30 2002-04-21 Target Technology Ct Ceramic heat-generating element and method for manufacturing thereof
US6848316B2 (en) * 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
US6944008B2 (en) * 2002-12-18 2005-09-13 Lucent Technologies Inc. Charge dissipation in electrostatically driven devices
CN101400824A (zh) * 2006-02-08 2009-04-01 瓦里安半导体设备公司 使用离子注入表面改性催化无电沉积来沉积金属膜的技术
US9369553B2 (en) * 2012-11-14 2016-06-14 Gtat Corporation Mobile electronic device comprising an ultrathin sapphire cover plate
US9407746B2 (en) * 2012-12-27 2016-08-02 Gtat Corporation Mobile electronic device comprising a sapphire cover plate having a low level of inclusions
US9092187B2 (en) 2013-01-08 2015-07-28 Apple Inc. Ion implant indicia for cover glass or display component
US9623628B2 (en) 2013-01-10 2017-04-18 Apple Inc. Sapphire component with residual compressive stress
CN104145320B (zh) 2013-02-12 2018-02-02 苹果公司 多步骤离子注入
US9416442B2 (en) 2013-03-02 2016-08-16 Apple Inc. Sapphire property modification through ion implantation
US10280504B2 (en) 2015-09-25 2019-05-07 Apple Inc. Ion-implanted, anti-reflective layer formed within sapphire material

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2950996A (en) * 1957-12-05 1960-08-30 Beckman Instruments Inc Electrical resistance material and method of making same
US3390012A (en) * 1964-05-14 1968-06-25 Texas Instruments Inc Method of making dielectric bodies having conducting portions
US3481776A (en) * 1966-07-18 1969-12-02 Sprague Electric Co Ion implantation to form conductive contact
US3562022A (en) * 1967-12-26 1971-02-09 Hughes Aircraft Co Method of doping semiconductor bodies by indirection implantation
US3600797A (en) * 1967-12-26 1971-08-24 Hughes Aircraft Co Method of making ohmic contacts to semiconductor bodies by indirect ion implantation
US3523042A (en) * 1967-12-26 1970-08-04 Hughes Aircraft Co Method of making bipolar transistor devices
US3718502A (en) * 1969-10-15 1973-02-27 J Gibbons Enhancement of diffusion of atoms into a heated substrate by bombardment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016509246A (ja) * 2012-12-11 2016-03-24 ジーティーエイティー コーポレーションGtat Corporation 改質サファイアを含有してなる携帯用電子機器

Also Published As

Publication number Publication date
DE2202585B2 (de) 1976-12-30
IL38468A0 (en) 1972-02-29
IT948212B (it) 1973-05-30
FR2124361B1 (cg-RX-API-DMAC10.html) 1976-01-16
US4088799A (en) 1978-05-09
IL38468A (en) 1974-11-29
GB1346517A (en) 1974-02-13
DE2202585A1 (de) 1972-08-10
FR2124361A1 (cg-RX-API-DMAC10.html) 1972-09-22

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