JPS5117383B2 - - Google Patents
Info
- Publication number
- JPS5117383B2 JPS5117383B2 JP47062967A JP6296772A JPS5117383B2 JP S5117383 B2 JPS5117383 B2 JP S5117383B2 JP 47062967 A JP47062967 A JP 47062967A JP 6296772 A JP6296772 A JP 6296772A JP S5117383 B2 JPS5117383 B2 JP S5117383B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47062967A JPS5117383B2 (https=) | 1972-06-22 | 1972-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47062967A JPS5117383B2 (https=) | 1972-06-22 | 1972-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4923577A JPS4923577A (https=) | 1974-03-02 |
| JPS5117383B2 true JPS5117383B2 (https=) | 1976-06-02 |
Family
ID=13215600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47062967A Expired JPS5117383B2 (https=) | 1972-06-22 | 1972-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5117383B2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314468B2 (https=) * | 1974-09-06 | 1978-05-17 | ||
| JPS522171A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Electronic parts |
| JPS5629969Y2 (https=) * | 1975-11-14 | 1981-07-16 | ||
| JPS5554638Y2 (https=) * | 1977-05-13 | 1980-12-17 | ||
| JPS55152741A (en) * | 1979-05-17 | 1980-11-28 | Mitsui Toatsu Chem Inc | Phenol-modified melamine resin with improved stability |
| JPS568857A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS568858A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS6163843U (https=) * | 1984-09-28 | 1986-04-30 | ||
| JP2654958B2 (ja) * | 1988-03-11 | 1997-09-17 | 日本化成株式会社 | フェノール変性メラミン樹脂接着剤 |
-
1972
- 1972-06-22 JP JP47062967A patent/JPS5117383B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4923577A (https=) | 1974-03-02 |