JPS5629969Y2 - - Google Patents

Info

Publication number
JPS5629969Y2
JPS5629969Y2 JP1975155358U JP15535875U JPS5629969Y2 JP S5629969 Y2 JPS5629969 Y2 JP S5629969Y2 JP 1975155358 U JP1975155358 U JP 1975155358U JP 15535875 U JP15535875 U JP 15535875U JP S5629969 Y2 JPS5629969 Y2 JP S5629969Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975155358U
Other languages
Japanese (ja)
Other versions
JPS5268171U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975155358U priority Critical patent/JPS5629969Y2/ja
Publication of JPS5268171U publication Critical patent/JPS5268171U/ja
Application granted granted Critical
Publication of JPS5629969Y2 publication Critical patent/JPS5629969Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP1975155358U 1975-11-14 1975-11-14 Expired JPS5629969Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975155358U JPS5629969Y2 (https=) 1975-11-14 1975-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975155358U JPS5629969Y2 (https=) 1975-11-14 1975-11-14

Publications (2)

Publication Number Publication Date
JPS5268171U JPS5268171U (https=) 1977-05-20
JPS5629969Y2 true JPS5629969Y2 (https=) 1981-07-16

Family

ID=28634565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975155358U Expired JPS5629969Y2 (https=) 1975-11-14 1975-11-14

Country Status (1)

Country Link
JP (1) JPS5629969Y2 (https=)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117383B2 (https=) * 1972-06-22 1976-06-02

Also Published As

Publication number Publication date
JPS5268171U (https=) 1977-05-20

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