JPS5314468B2 - - Google Patents
Info
- Publication number
- JPS5314468B2 JPS5314468B2 JP10210174A JP10210174A JPS5314468B2 JP S5314468 B2 JPS5314468 B2 JP S5314468B2 JP 10210174 A JP10210174 A JP 10210174A JP 10210174 A JP10210174 A JP 10210174A JP S5314468 B2 JPS5314468 B2 JP S5314468B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210174A JPS5314468B2 (https=) | 1974-09-06 | 1974-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210174A JPS5314468B2 (https=) | 1974-09-06 | 1974-09-06 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8400580A Division JPS568857A (en) | 1980-06-23 | 1980-06-23 | Resin sealing type semiconductor device |
| JP8400680A Division JPS568858A (en) | 1980-06-23 | 1980-06-23 | Resin sealing type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5129874A JPS5129874A (https=) | 1976-03-13 |
| JPS5314468B2 true JPS5314468B2 (https=) | 1978-05-17 |
Family
ID=14318386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10210174A Expired JPS5314468B2 (https=) | 1974-09-06 | 1974-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5314468B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS611042A (ja) * | 1984-06-13 | 1986-01-07 | Toshiba Corp | 半導体装置 |
| JP2025527352A (ja) * | 2022-08-18 | 2025-08-20 | ヒタチ・エナジー・リミテッド | 半導体パワーモジュールおよび半導体パワーモジュールを製造するための方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117383B2 (https=) * | 1972-06-22 | 1976-06-02 |
-
1974
- 1974-09-06 JP JP10210174A patent/JPS5314468B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5129874A (https=) | 1976-03-13 |