JPS5115791A - - Google Patents

Info

Publication number
JPS5115791A
JPS5115791A JP49086996A JP8699674A JPS5115791A JP S5115791 A JPS5115791 A JP S5115791A JP 49086996 A JP49086996 A JP 49086996A JP 8699674 A JP8699674 A JP 8699674A JP S5115791 A JPS5115791 A JP S5115791A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49086996A
Other languages
Japanese (ja)
Other versions
JPS5843763B2 (ja
Inventor
Sumio Yamaguchi
Osamu Morita
Juzaburo Sakamoto
Naohiro Horii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49086996A priority Critical patent/JPS5843763B2/ja
Publication of JPS5115791A publication Critical patent/JPS5115791A/ja
Publication of JPS5843763B2 publication Critical patent/JPS5843763B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP49086996A 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ Expired JPS5843763B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49086996A JPS5843763B2 (ja) 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49086996A JPS5843763B2 (ja) 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ

Publications (2)

Publication Number Publication Date
JPS5115791A true JPS5115791A (enrdf_load_stackoverflow) 1976-02-07
JPS5843763B2 JPS5843763B2 (ja) 1983-09-29

Family

ID=13902474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49086996A Expired JPS5843763B2 (ja) 1974-07-31 1974-07-31 クリカエシウンドウキコウト サ−ボキコウニヨル フクゴウウンドウキコウ

Country Status (1)

Country Link
JP (1) JPS5843763B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092560U (ja) * 1983-11-30 1985-06-24 株式会社ダイキンゴルフ ウツドクラブのヘツド

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107922U (ja) * 1991-02-28 1992-09-17 日本特殊陶業株式会社 梯子型電気濾波器
JPH04110025U (ja) * 1991-03-12 1992-09-24 日本特殊陶業株式会社 梯子型電気濾波器ケース
JPH0528122U (ja) * 1991-09-18 1993-04-09 日本特殊陶業株式会社 圧電フイルタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092560U (ja) * 1983-11-30 1985-06-24 株式会社ダイキンゴルフ ウツドクラブのヘツド

Also Published As

Publication number Publication date
JPS5843763B2 (ja) 1983-09-29

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