JPS51149785A - Method of manufacturing semiconductor light emission device - Google Patents

Method of manufacturing semiconductor light emission device

Info

Publication number
JPS51149785A
JPS51149785A JP6059676A JP6059676A JPS51149785A JP S51149785 A JPS51149785 A JP S51149785A JP 6059676 A JP6059676 A JP 6059676A JP 6059676 A JP6059676 A JP 6059676A JP S51149785 A JPS51149785 A JP S51149785A
Authority
JP
Japan
Prior art keywords
semiconductor light
light emission
emission device
manufacturing semiconductor
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6059676A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5311838B2 (cs
Inventor
Tetsuo Sadamasa
Tadao Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6059676A priority Critical patent/JPS51149785A/ja
Publication of JPS51149785A publication Critical patent/JPS51149785A/ja
Publication of JPS5311838B2 publication Critical patent/JPS5311838B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP6059676A 1976-05-27 1976-05-27 Method of manufacturing semiconductor light emission device Granted JPS51149785A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6059676A JPS51149785A (en) 1976-05-27 1976-05-27 Method of manufacturing semiconductor light emission device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6059676A JPS51149785A (en) 1976-05-27 1976-05-27 Method of manufacturing semiconductor light emission device

Publications (2)

Publication Number Publication Date
JPS51149785A true JPS51149785A (en) 1976-12-22
JPS5311838B2 JPS5311838B2 (cs) 1978-04-25

Family

ID=13146768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6059676A Granted JPS51149785A (en) 1976-05-27 1976-05-27 Method of manufacturing semiconductor light emission device

Country Status (1)

Country Link
JP (1) JPS51149785A (cs)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PHYSICAL REVIEW#N2=1966 *

Also Published As

Publication number Publication date
JPS5311838B2 (cs) 1978-04-25

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