JPS51135836A - Electroless copper plating solusion - Google Patents

Electroless copper plating solusion

Info

Publication number
JPS51135836A
JPS51135836A JP50060754A JP6075475A JPS51135836A JP S51135836 A JPS51135836 A JP S51135836A JP 50060754 A JP50060754 A JP 50060754A JP 6075475 A JP6075475 A JP 6075475A JP S51135836 A JPS51135836 A JP S51135836A
Authority
JP
Japan
Prior art keywords
solusion
copper plating
electroless copper
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50060754A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56504B2 (cg-RX-API-DMAC7.html
Inventor
Masahiro Oida
Heigo Hirohata
Nobuhiro Hamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50060754A priority Critical patent/JPS51135836A/ja
Publication of JPS51135836A publication Critical patent/JPS51135836A/ja
Publication of JPS56504B2 publication Critical patent/JPS56504B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
JP50060754A 1975-05-20 1975-05-20 Electroless copper plating solusion Granted JPS51135836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50060754A JPS51135836A (en) 1975-05-20 1975-05-20 Electroless copper plating solusion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50060754A JPS51135836A (en) 1975-05-20 1975-05-20 Electroless copper plating solusion

Publications (2)

Publication Number Publication Date
JPS51135836A true JPS51135836A (en) 1976-11-25
JPS56504B2 JPS56504B2 (cg-RX-API-DMAC7.html) 1981-01-08

Family

ID=13151364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50060754A Granted JPS51135836A (en) 1975-05-20 1975-05-20 Electroless copper plating solusion

Country Status (1)

Country Link
JP (1) JPS51135836A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320474A (ja) * 1989-06-15 1991-01-29 Matsushita Electric Ind Co Ltd 無電解銅めっき液
JP2016531206A (ja) * 2013-09-05 2016-10-06 エンソン インコーポレイテッド 大気中放出が低減した水性電解液組成物、方法、及び該組成物の使用

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320474A (ja) * 1989-06-15 1991-01-29 Matsushita Electric Ind Co Ltd 無電解銅めっき液
JP2016531206A (ja) * 2013-09-05 2016-10-06 エンソン インコーポレイテッド 大気中放出が低減した水性電解液組成物、方法、及び該組成物の使用
US10081876B2 (en) 2013-09-05 2018-09-25 Macdermid Enthone Inc. Aqueous electrolyte composition having a reduced airborne emission, method and use of this composition

Also Published As

Publication number Publication date
JPS56504B2 (cg-RX-API-DMAC7.html) 1981-01-08

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