JPS51135836A - Electroless copper plating solusion - Google Patents

Electroless copper plating solusion

Info

Publication number
JPS51135836A
JPS51135836A JP50060754A JP6075475A JPS51135836A JP S51135836 A JPS51135836 A JP S51135836A JP 50060754 A JP50060754 A JP 50060754A JP 6075475 A JP6075475 A JP 6075475A JP S51135836 A JPS51135836 A JP S51135836A
Authority
JP
Japan
Prior art keywords
solusion
copper plating
electroless copper
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50060754A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56504B2 (Sortimente
Inventor
Masahiro Oida
Heigo Hirohata
Nobuhiro Hamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50060754A priority Critical patent/JPS51135836A/ja
Publication of JPS51135836A publication Critical patent/JPS51135836A/ja
Publication of JPS56504B2 publication Critical patent/JPS56504B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
JP50060754A 1975-05-20 1975-05-20 Electroless copper plating solusion Granted JPS51135836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50060754A JPS51135836A (en) 1975-05-20 1975-05-20 Electroless copper plating solusion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50060754A JPS51135836A (en) 1975-05-20 1975-05-20 Electroless copper plating solusion

Publications (2)

Publication Number Publication Date
JPS51135836A true JPS51135836A (en) 1976-11-25
JPS56504B2 JPS56504B2 (Sortimente) 1981-01-08

Family

ID=13151364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50060754A Granted JPS51135836A (en) 1975-05-20 1975-05-20 Electroless copper plating solusion

Country Status (1)

Country Link
JP (1) JPS51135836A (Sortimente)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320474A (ja) * 1989-06-15 1991-01-29 Matsushita Electric Ind Co Ltd 無電解銅めっき液
JP2016531206A (ja) * 2013-09-05 2016-10-06 エンソン インコーポレイテッド 大気中放出が低減した水性電解液組成物、方法、及び該組成物の使用

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320474A (ja) * 1989-06-15 1991-01-29 Matsushita Electric Ind Co Ltd 無電解銅めっき液
JP2016531206A (ja) * 2013-09-05 2016-10-06 エンソン インコーポレイテッド 大気中放出が低減した水性電解液組成物、方法、及び該組成物の使用
US10081876B2 (en) 2013-09-05 2018-09-25 Macdermid Enthone Inc. Aqueous electrolyte composition having a reduced airborne emission, method and use of this composition

Also Published As

Publication number Publication date
JPS56504B2 (Sortimente) 1981-01-08

Similar Documents

Publication Publication Date Title
DE2964079D1 (en) An electroless copper plating process
JPS51149134A (en) Nonncyanideeseries silver plating bath
DE3066952D1 (en) Electroless copper plating solution
ZA764048B (en) Alloy plating
IL51772A (en) Electroless copper plating
IL41331A0 (en) Electroless copper plating
AU501210B2 (en) Electroless copper plating bath
JPS5220339A (en) Chemical copper plating solution
JPS5370931A (en) Nonnelectrolytic copper plating method
JPS5217335A (en) Chemical copper plating solution
GB1555709A (en) Electroless nickel plating
JPS5278632A (en) Peeling solution for silver plating
JPS5448646A (en) Copper electroplating
JPS5217334A (en) Electroless copper plating solution
JPS5217333A (en) Plating solution
ZA762314B (en) Electroless plating substrates
JPS51135836A (en) Electroless copper plating solusion
JPS5260869A (en) Method of electroless copper plating
JPS5216432A (en) Plated conductor
JPS5221226A (en) Nonnelectric copper plating solution
JPS5277833A (en) Nonnelectrolytic copper plating solution
GB1553081A (en) Metal plating
HK4981A (en) Electroless copper plating solutions
JPS53142328A (en) Solution for nonnelectrolytic copper plating
JPS5285935A (en) Peeling solution for copper plating