JPS5112992B2 - - Google Patents

Info

Publication number
JPS5112992B2
JPS5112992B2 JP47073008A JP7300872A JPS5112992B2 JP S5112992 B2 JPS5112992 B2 JP S5112992B2 JP 47073008 A JP47073008 A JP 47073008A JP 7300872 A JP7300872 A JP 7300872A JP S5112992 B2 JPS5112992 B2 JP S5112992B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47073008A
Other languages
Japanese (ja)
Other versions
JPS4850679A (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4850679A publication Critical patent/JPS4850679A/ja
Publication of JPS5112992B2 publication Critical patent/JPS5112992B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/03Manufacture or treatment wherein the substrate comprises sapphire, e.g. silicon-on-sapphire [SOS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • H10D88/01Manufacture or treatment
    • H10P90/1906
    • H10P95/00
    • H10W10/021
    • H10W10/061
    • H10W10/181
    • H10W10/20
    • H10W20/40
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/008Bi-level fabrication
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/122Polycrystalline
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/15Silicon on sapphire SOS

Landscapes

  • Element Separation (AREA)
  • Thin Film Transistor (AREA)
JP47073008A 1971-10-21 1972-07-20 Expired JPS5112992B2 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19145571A 1971-10-21 1971-10-21

Publications (2)

Publication Number Publication Date
JPS4850679A JPS4850679A (cg-RX-API-DMAC10.html) 1973-07-17
JPS5112992B2 true JPS5112992B2 (cg-RX-API-DMAC10.html) 1976-04-23

Family

ID=22705564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47073008A Expired JPS5112992B2 (cg-RX-API-DMAC10.html) 1971-10-21 1972-07-20

Country Status (12)

Country Link
US (1) US3791024A (cg-RX-API-DMAC10.html)
JP (1) JPS5112992B2 (cg-RX-API-DMAC10.html)
AU (1) AU462435B2 (cg-RX-API-DMAC10.html)
BE (1) BE786089A (cg-RX-API-DMAC10.html)
CA (1) CA967288A (cg-RX-API-DMAC10.html)
DE (1) DE2235185A1 (cg-RX-API-DMAC10.html)
ES (2) ES404273A1 (cg-RX-API-DMAC10.html)
FR (1) FR2156543B1 (cg-RX-API-DMAC10.html)
GB (1) GB1339095A (cg-RX-API-DMAC10.html)
IT (1) IT956533B (cg-RX-API-DMAC10.html)
NL (1) NL7209192A (cg-RX-API-DMAC10.html)
SE (1) SE376327B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10927545B2 (en) 2010-05-05 2021-02-23 Allsteel Inc. Modular wall system

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074304A (en) * 1974-10-04 1978-02-14 Nippon Electric Company, Ltd. Semiconductor device having a miniature junction area and process for fabricating same
US4094057A (en) * 1976-03-29 1978-06-13 International Business Machines Corporation Field effect transistor lost film fabrication process
JPS5721856B2 (en) * 1977-11-28 1982-05-10 Nippon Telegraph & Telephone Semiconductor and its manufacture
US4199384A (en) * 1979-01-29 1980-04-22 Rca Corporation Method of making a planar semiconductor on insulating substrate device utilizing the deposition of a dual dielectric layer between device islands
JPH0628313B2 (ja) * 1982-01-19 1994-04-13 キヤノン株式会社 半導体素子
US4481707A (en) * 1983-02-24 1984-11-13 The United States Of America As Represented By The Secretary Of The Air Force Method for the fabrication of dielectric isolated junction field effect transistor and PNP transistor
JPS6072243A (ja) * 1983-09-28 1985-04-24 Matsushita Electric Ind Co Ltd 半導体集積回路装置
US4879585A (en) * 1984-03-31 1989-11-07 Kabushiki Kaisha Toshiba Semiconductor device
US4897698A (en) * 1984-10-31 1990-01-30 Texas Instruments Incorporated Horizontal structure thin film transistor
JPH01162376A (ja) * 1987-12-18 1989-06-26 Fujitsu Ltd 半導体装置の製造方法
US5525536A (en) * 1991-12-26 1996-06-11 Rohm Co., Ltd. Method for producing SOI substrate and semiconductor device using the same
US5952695A (en) * 1997-03-05 1999-09-14 International Business Machines Corporation Silicon-on-insulator and CMOS-on-SOI double film structures
US5889293A (en) * 1997-04-04 1999-03-30 International Business Machines Corporation Electrical contact to buried SOI structures
US5834350A (en) * 1997-06-11 1998-11-10 Advanced Micro Devices, Inc. Elevated transistor fabrication technique
US6353246B1 (en) * 1998-11-23 2002-03-05 International Business Machines Corporation Semiconductor device including dislocation in merged SOI/DRAM chips
JP4540146B2 (ja) * 1998-12-24 2010-09-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US6259135B1 (en) 1999-09-24 2001-07-10 International Business Machines Corporation MOS transistors structure for reducing the size of pitch limited circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290753A (en) * 1963-08-19 1966-12-13 Bell Telephone Labor Inc Method of making semiconductor integrated circuit elements
US3359467A (en) * 1965-02-04 1967-12-19 Texas Instruments Inc Resistors for integrated circuits
US3442011A (en) * 1965-06-30 1969-05-06 Texas Instruments Inc Method for isolating individual devices in an integrated circuit monolithic bar
US3519901A (en) * 1968-01-29 1970-07-07 Texas Instruments Inc Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10927545B2 (en) 2010-05-05 2021-02-23 Allsteel Inc. Modular wall system

Also Published As

Publication number Publication date
US3791024A (en) 1974-02-12
SE376327B (cg-RX-API-DMAC10.html) 1975-05-12
FR2156543A1 (cg-RX-API-DMAC10.html) 1973-06-01
ES410640A1 (es) 1975-12-01
BE786089A (fr) 1972-11-03
CA967288A (en) 1975-05-06
GB1339095A (en) 1973-11-28
JPS4850679A (cg-RX-API-DMAC10.html) 1973-07-17
AU462435B2 (en) 1975-06-26
AU4573072A (en) 1974-03-07
ES404273A1 (es) 1975-06-01
NL7209192A (cg-RX-API-DMAC10.html) 1973-04-25
IT956533B (it) 1973-10-10
FR2156543B1 (cg-RX-API-DMAC10.html) 1977-08-26
DE2235185A1 (de) 1973-04-26

Similar Documents

Publication Publication Date Title
FI51747B (cg-RX-API-DMAC10.html)
FR2156543B1 (cg-RX-API-DMAC10.html)
FR2122165A5 (cg-RX-API-DMAC10.html)
FR2114959A5 (cg-RX-API-DMAC10.html)
FR2124424A1 (cg-RX-API-DMAC10.html)
FR2122922A5 (cg-RX-API-DMAC10.html)
FR2121878B1 (cg-RX-API-DMAC10.html)
FR2123502A1 (cg-RX-API-DMAC10.html)
FR2125621B1 (cg-RX-API-DMAC10.html)
FR2125594B1 (cg-RX-API-DMAC10.html)
FR2121372B1 (cg-RX-API-DMAC10.html)
DE2142243C3 (cg-RX-API-DMAC10.html)
FR2120578A5 (cg-RX-API-DMAC10.html)
FR2141693B1 (cg-RX-API-DMAC10.html)
FR2122378B2 (cg-RX-API-DMAC10.html)
FR2090649A5 (cg-RX-API-DMAC10.html)
AU4958672A (cg-RX-API-DMAC10.html)
DE2134613A1 (cg-RX-API-DMAC10.html)
FR2123189A1 (cg-RX-API-DMAC10.html)
DE2127345A1 (cg-RX-API-DMAC10.html)
BE790406A (cg-RX-API-DMAC10.html)
DD98356A5 (cg-RX-API-DMAC10.html)
BG17247A1 (cg-RX-API-DMAC10.html)
BG17090A1 (cg-RX-API-DMAC10.html)
BG17087A1 (cg-RX-API-DMAC10.html)