JPS51129498A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS51129498A
JPS51129498A JP50039191A JP3919175A JPS51129498A JP S51129498 A JPS51129498 A JP S51129498A JP 50039191 A JP50039191 A JP 50039191A JP 3919175 A JP3919175 A JP 3919175A JP S51129498 A JPS51129498 A JP S51129498A
Authority
JP
Japan
Prior art keywords
resin composition
thermosetting resin
compn
mech
usable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50039191A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5419919B2 (enExample
Inventor
Morimichi Unno
Masahiko Sakai
Toshikazu Narahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50039191A priority Critical patent/JPS51129498A/ja
Publication of JPS51129498A publication Critical patent/JPS51129498A/ja
Publication of JPS5419919B2 publication Critical patent/JPS5419919B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP50039191A 1975-04-02 1975-04-02 Thermosetting resin composition Granted JPS51129498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50039191A JPS51129498A (en) 1975-04-02 1975-04-02 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50039191A JPS51129498A (en) 1975-04-02 1975-04-02 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS51129498A true JPS51129498A (en) 1976-11-11
JPS5419919B2 JPS5419919B2 (enExample) 1979-07-18

Family

ID=12546212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50039191A Granted JPS51129498A (en) 1975-04-02 1975-04-02 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS51129498A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113062A (en) * 1980-12-31 1982-07-14 Toshiba Chem Prod Copper plated laminated board
JPS60255831A (ja) * 1984-06-01 1985-12-17 Sumitomo Bakelite Co Ltd エポキシ樹脂積層板の製造方法
JPS63135434A (ja) * 1986-11-26 1988-06-07 Shin Kobe Electric Mach Co Ltd エポキシ樹脂積層板の製造法
US5006611A (en) * 1989-01-20 1991-04-09 Ciba-Geigy Corporation Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups
WO1997012925A1 (fr) * 1995-09-29 1997-04-10 Toshiba Chemical Corporation Composition de resine retardatrice de flamme et sans halogenes, et pre-impregne et stratifie contenant cette composition
WO1997047689A1 (en) * 1996-06-14 1997-12-18 Cytec Technology Corp. Curable thermoset resin composition
US6214455B1 (en) 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
CN1073127C (zh) * 1995-09-29 2001-10-17 东芝化学株式会社 无卤素的阻燃性环氧树脂组合物及含有此树脂组合物的预浸料和叠层板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS475947A (enExample) * 1970-09-03 1972-03-31
JPS4851997A (enExample) * 1971-10-28 1973-07-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS475947A (enExample) * 1970-09-03 1972-03-31
JPS4851997A (enExample) * 1971-10-28 1973-07-21

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113062A (en) * 1980-12-31 1982-07-14 Toshiba Chem Prod Copper plated laminated board
JPS60255831A (ja) * 1984-06-01 1985-12-17 Sumitomo Bakelite Co Ltd エポキシ樹脂積層板の製造方法
JPS63135434A (ja) * 1986-11-26 1988-06-07 Shin Kobe Electric Mach Co Ltd エポキシ樹脂積層板の製造法
US5006611A (en) * 1989-01-20 1991-04-09 Ciba-Geigy Corporation Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups
WO1997012925A1 (fr) * 1995-09-29 1997-04-10 Toshiba Chemical Corporation Composition de resine retardatrice de flamme et sans halogenes, et pre-impregne et stratifie contenant cette composition
US5955184A (en) * 1995-09-29 1999-09-21 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same
US6214455B1 (en) 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
CN1073127C (zh) * 1995-09-29 2001-10-17 东芝化学株式会社 无卤素的阻燃性环氧树脂组合物及含有此树脂组合物的预浸料和叠层板
WO1997047689A1 (en) * 1996-06-14 1997-12-18 Cytec Technology Corp. Curable thermoset resin composition
US6265491B1 (en) 1996-06-14 2001-07-24 Cytec Technology Corp. Curable thermoset resin composition

Also Published As

Publication number Publication date
JPS5419919B2 (enExample) 1979-07-18

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