JPS51123079A - Thyristor stack - Google Patents

Thyristor stack

Info

Publication number
JPS51123079A
JPS51123079A JP51039158A JP3915876A JPS51123079A JP S51123079 A JPS51123079 A JP S51123079A JP 51039158 A JP51039158 A JP 51039158A JP 3915876 A JP3915876 A JP 3915876A JP S51123079 A JPS51123079 A JP S51123079A
Authority
JP
Japan
Prior art keywords
thyristor stack
thyristor
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51039158A
Other languages
Japanese (ja)
Inventor
Kuriishiyu Giyunta
Ueeba Rorufu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS51123079A publication Critical patent/JPS51123079A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP51039158A 1975-04-07 1976-04-07 Thyristor stack Pending JPS51123079A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2515046A DE2515046C3 (en) 1975-04-07 1975-04-07 Thyristor column

Publications (1)

Publication Number Publication Date
JPS51123079A true JPS51123079A (en) 1976-10-27

Family

ID=5943225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51039158A Pending JPS51123079A (en) 1975-04-07 1976-04-07 Thyristor stack

Country Status (8)

Country Link
JP (1) JPS51123079A (en)
AT (1) AT338380B (en)
BE (1) BE840381A (en)
CH (1) CH590560A5 (en)
DE (1) DE2515046C3 (en)
FR (1) FR2307376A1 (en)
IN (1) IN143133B (en)
SE (1) SE7601879L (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH629913A5 (en) * 1977-07-12 1982-05-14 Asea Ab LIQUID-COOLED THYRISTOR VALVE.
CH661151A5 (en) * 1980-06-03 1987-06-30 Mitsubishi Electric Corp Semiconductor element stack.
JPS57196553A (en) * 1981-05-28 1982-12-02 Toshiba Corp Water cooling thyristor converter
FR2524760B1 (en) * 1982-03-30 1986-10-10 Auxilec HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
DE19805820A1 (en) * 1998-02-13 1999-08-19 Asea Brown Boveri Semiconductor clamped stack for high power rectifier
DE19937671B4 (en) * 1999-08-10 2011-04-21 Siemens Ag Air-cooled converter bridge circuit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4721093U (en) * 1971-03-09 1972-11-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4721093U (en) * 1971-03-09 1972-11-09

Also Published As

Publication number Publication date
IN143133B (en) 1977-10-08
ATA104176A (en) 1976-12-15
DE2515046A1 (en) 1976-10-14
FR2307376A1 (en) 1976-11-05
AT338380B (en) 1977-08-25
FR2307376B1 (en) 1979-02-02
CH590560A5 (en) 1977-08-15
SE7601879L (en) 1976-10-08
DE2515046C3 (en) 1980-03-20
DE2515046B2 (en) 1979-07-05
BE840381A (en) 1976-08-02

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