JPS51119632A - Process for treating etching agents - Google Patents
Process for treating etching agentsInfo
- Publication number
- JPS51119632A JPS51119632A JP4486175A JP4486175A JPS51119632A JP S51119632 A JPS51119632 A JP S51119632A JP 4486175 A JP4486175 A JP 4486175A JP 4486175 A JP4486175 A JP 4486175A JP S51119632 A JPS51119632 A JP S51119632A
- Authority
- JP
- Japan
- Prior art keywords
- etching agents
- treating etching
- treating
- agents
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4486175A JPS51119632A (en) | 1975-04-15 | 1975-04-15 | Process for treating etching agents |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4486175A JPS51119632A (en) | 1975-04-15 | 1975-04-15 | Process for treating etching agents |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51119632A true JPS51119632A (en) | 1976-10-20 |
Family
ID=12703256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4486175A Pending JPS51119632A (en) | 1975-04-15 | 1975-04-15 | Process for treating etching agents |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51119632A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS552763A (en) * | 1978-06-23 | 1980-01-10 | Hideo Tsubaki | Electrolysis method of chlorine compound etching solution |
US5393387A (en) * | 1991-10-28 | 1995-02-28 | Nittetsu Mining Co., Ltd. | Method for treating etchant |
WO2004111308A1 (en) * | 2003-06-13 | 2004-12-23 | Atotech Deutschland Gmbh | Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method |
CN103422154A (zh) * | 2012-05-24 | 2013-12-04 | 叶福祥 | 电路板酸性废蚀刻液氯化亚铜(Cu+,CuCL)离子隔膜电积再生 |
-
1975
- 1975-04-15 JP JP4486175A patent/JPS51119632A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS552763A (en) * | 1978-06-23 | 1980-01-10 | Hideo Tsubaki | Electrolysis method of chlorine compound etching solution |
JPS582272B2 (ja) * | 1978-06-23 | 1983-01-14 | 椿 秀夫 | 塩素化合物腐蝕液の電解方法 |
US5393387A (en) * | 1991-10-28 | 1995-02-28 | Nittetsu Mining Co., Ltd. | Method for treating etchant |
WO2004111308A1 (en) * | 2003-06-13 | 2004-12-23 | Atotech Deutschland Gmbh | Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method |
CN100413999C (zh) * | 2003-06-13 | 2008-08-27 | 德国艾托科技公司 | 再生用于蚀刻或酸蚀铜或铜合金的含铁蚀刻溶液的方法和进行所述方法的装置 |
US7520973B2 (en) | 2003-06-13 | 2009-04-21 | Atotech Deutschland Gmbh | Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method |
KR101052245B1 (ko) | 2003-06-13 | 2011-07-27 | 아토테크더치랜드게엠베하 | 구리 또는 구리 합금의 에칭 또는 피클링용 철 함유에칭액의 재생방법 및 상기 방법을 실행하기 위한 장치 |
CN103422154A (zh) * | 2012-05-24 | 2013-12-04 | 叶福祥 | 电路板酸性废蚀刻液氯化亚铜(Cu+,CuCL)离子隔膜电积再生 |
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