JPS51117949A - Flow solder bath - Google Patents
Flow solder bathInfo
- Publication number
- JPS51117949A JPS51117949A JP4322075A JP4322075A JPS51117949A JP S51117949 A JPS51117949 A JP S51117949A JP 4322075 A JP4322075 A JP 4322075A JP 4322075 A JP4322075 A JP 4322075A JP S51117949 A JPS51117949 A JP S51117949A
- Authority
- JP
- Japan
- Prior art keywords
- solder bath
- flow solder
- flow
- bath
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4322075A JPS51117949A (en) | 1975-04-11 | 1975-04-11 | Flow solder bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4322075A JPS51117949A (en) | 1975-04-11 | 1975-04-11 | Flow solder bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51117949A true JPS51117949A (en) | 1976-10-16 |
| JPS5430389B2 JPS5430389B2 (Direct) | 1979-09-29 |
Family
ID=12657819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4322075A Granted JPS51117949A (en) | 1975-04-11 | 1975-04-11 | Flow solder bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51117949A (Direct) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858795A (ja) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | プリント基板のはんだ付け方法 |
| JPS5861962A (ja) * | 1981-10-06 | 1983-04-13 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
| JPS59220278A (ja) * | 1983-05-31 | 1984-12-11 | Japan Fuirudo Kk | 片面ハンダ付方法および装置 |
| JPS61264795A (ja) * | 1985-05-18 | 1986-11-22 | 株式会社東芝 | 印刷配線板の半田付け方法 |
| EP1733833A1 (de) * | 2005-06-17 | 2006-12-20 | Linde Aktiengesellschaft | Vorrichtung zum Wellenlöten mit einer mehrere Lotaustrittsöffnungen aufweisenden Lötdüse, deren Dichte sich in Förderrichtung der Werkstücke ändert |
-
1975
- 1975-04-11 JP JP4322075A patent/JPS51117949A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858795A (ja) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | プリント基板のはんだ付け方法 |
| JPS5861962A (ja) * | 1981-10-06 | 1983-04-13 | Tamura Seisakusho Co Ltd | 噴流式はんだ付け装置 |
| JPS59220278A (ja) * | 1983-05-31 | 1984-12-11 | Japan Fuirudo Kk | 片面ハンダ付方法および装置 |
| JPS61264795A (ja) * | 1985-05-18 | 1986-11-22 | 株式会社東芝 | 印刷配線板の半田付け方法 |
| EP1733833A1 (de) * | 2005-06-17 | 2006-12-20 | Linde Aktiengesellschaft | Vorrichtung zum Wellenlöten mit einer mehrere Lotaustrittsöffnungen aufweisenden Lötdüse, deren Dichte sich in Förderrichtung der Werkstücke ändert |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5430389B2 (Direct) | 1979-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS51149134A (en) | Nonncyanideeseries silver plating bath | |
| JPS5211132A (en) | Electroplating bath | |
| JPS5268085A (en) | Defoaming agents | |
| ZA764048B (en) | Alloy plating | |
| JPS5280288A (en) | Defoaming agents | |
| NZ179842A (en) | Dental solder | |
| GB1550361A (en) | Baths | |
| JPS51117949A (en) | Flow solder bath | |
| JPS5280287A (en) | Defoaming agents | |
| JPS5280286A (en) | Defoaming agents | |
| JPS52142643A (en) | Solder piece | |
| JPS5273154A (en) | Solder bath | |
| JPS5217333A (en) | Plating solution | |
| JPS5215426A (en) | Electroplating bath | |
| PH11739A (en) | Dental solder | |
| JPS51117948A (en) | Flow type solder bath | |
| JPS5222554A (en) | Flow type solder bath | |
| JPS51124649A (en) | Flow type solder bath | |
| JPS5273155A (en) | Flow type solder bath | |
| JPS5268050A (en) | Flow type soldering device | |
| GB1553081A (en) | Metal plating | |
| JPS51117147A (en) | Flow type solder bath | |
| JPS52103351A (en) | Solder bath | |
| JPS5258042A (en) | Dip soldering device | |
| JPS5211133A (en) | Electroplating bath |