JPS5099467A - - Google Patents

Info

Publication number
JPS5099467A
JPS5099467A JP49145830A JP14583074A JPS5099467A JP S5099467 A JPS5099467 A JP S5099467A JP 49145830 A JP49145830 A JP 49145830A JP 14583074 A JP14583074 A JP 14583074A JP S5099467 A JPS5099467 A JP S5099467A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49145830A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5099467A publication Critical patent/JPS5099467A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P50/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
JP49145830A 1973-12-28 1974-12-20 Pending JPS5099467A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US429240A US3869323A (en) 1973-12-28 1973-12-28 Method of polishing zinc selenide

Publications (1)

Publication Number Publication Date
JPS5099467A true JPS5099467A (ja) 1975-08-07

Family

ID=23702405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49145830A Pending JPS5099467A (ja) 1973-12-28 1974-12-20

Country Status (5)

Country Link
US (1) US3869323A (ja)
JP (1) JPS5099467A (ja)
DE (1) DE2441352A1 (ja)
FR (1) FR2256002B1 (ja)
GB (1) GB1443299A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290135A (ja) * 1986-06-10 1987-12-17 Nippon Mining Co Ltd ＣｄＴｅウェーハの鏡面研磨液ならびに鏡面研磨方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979239A (en) * 1974-12-30 1976-09-07 Monsanto Company Process for chemical-mechanical polishing of III-V semiconductor materials
US4435247A (en) 1983-03-10 1984-03-06 International Business Machines Corporation Method for polishing titanium carbide
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US5562530A (en) * 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
US5968238A (en) * 1998-02-18 1999-10-19 Turtle Wax, Inc. Polishing composition including water soluble polishing agent
FR2778356B1 (fr) * 1998-05-06 2000-08-04 Optique De Precision Et Applic Procede de traitement de pieces optiques
US7351662B2 (en) * 2005-01-07 2008-04-01 Dupont Air Products Nanomaterials Llc Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
RU2338014C2 (ru) * 2006-12-04 2008-11-10 Институт химии высокочистых веществ Российской академии наук (ИХВВ РАН) Способ обработки оптических элементов из селенида цинка
CN100469531C (zh) * 2007-09-14 2009-03-18 中国科学院上海光学精密机械研究所 氧化锌单晶衬底级基片的抛光方法
WO2016100448A1 (en) 2014-12-17 2016-06-23 Novartis Ag Reusable lens molds and methods of use thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL87792C (ja) * 1954-12-01
US3143447A (en) * 1960-12-22 1964-08-04 Marriner K Norr Chemical etches for lead telluride crystals
US3342652A (en) * 1964-04-02 1967-09-19 Ibm Chemical polishing of a semi-conductor substrate
US3429756A (en) * 1965-02-05 1969-02-25 Monsanto Co Method for the preparation of inorganic single crystal and polycrystalline electronic materials
US3629023A (en) * 1968-07-17 1971-12-21 Minnesota Mining & Mfg METHOD OF CHEMICALLY POLISHING CRYSTALS OF II(b){14 VI(a) SYSTEM
US3775201A (en) * 1971-10-26 1973-11-27 Ibm Method for polishing semiconductor gallium phosphide planar surfaces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290135A (ja) * 1986-06-10 1987-12-17 Nippon Mining Co Ltd ＣｄＴｅウェーハの鏡面研磨液ならびに鏡面研磨方法

Also Published As

Publication number Publication date
US3869323A (en) 1975-03-04
FR2256002B1 (ja) 1976-10-22
DE2441352A1 (de) 1975-07-10
FR2256002A1 (ja) 1975-07-25
GB1443299A (en) 1976-07-21

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