JPS509383B2 - - Google Patents

Info

Publication number
JPS509383B2
JPS509383B2 JP5968971A JP5968971A JPS509383B2 JP S509383 B2 JPS509383 B2 JP S509383B2 JP 5968971 A JP5968971 A JP 5968971A JP 5968971 A JP5968971 A JP 5968971A JP S509383 B2 JPS509383 B2 JP S509383B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5968971A
Other languages
Japanese (ja)
Other versions
JPS4826368A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5968971A priority Critical patent/JPS509383B2/ja
Priority to GB3613572A priority patent/GB1331028A/en
Priority to DE2238569A priority patent/DE2238569C3/de
Priority to CA148,789A priority patent/CA970079A/en
Priority to FR7228210A priority patent/FR2148480B1/fr
Publication of JPS4826368A publication Critical patent/JPS4826368A/ja
Priority to US443670A priority patent/US3879837A/en
Publication of JPS509383B2 publication Critical patent/JPS509383B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP5968971A 1971-08-07 1971-08-07 Expired JPS509383B2 (enrdf_load_stackoverflow)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP5968971A JPS509383B2 (enrdf_load_stackoverflow) 1971-08-07 1971-08-07
GB3613572A GB1331028A (en) 1971-08-07 1972-08-02 Method of soldering a semiconductor plate
DE2238569A DE2238569C3 (de) 1971-08-07 1972-08-04 Verfahren zum Löten einer Halbleiterplatte
CA148,789A CA970079A (en) 1971-08-07 1972-08-04 Method of soldering a semiconductor plate
FR7228210A FR2148480B1 (enrdf_load_stackoverflow) 1971-08-07 1972-08-04
US443670A US3879837A (en) 1971-08-07 1974-02-19 Method of soldering a semiconductor plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5968971A JPS509383B2 (enrdf_load_stackoverflow) 1971-08-07 1971-08-07

Publications (2)

Publication Number Publication Date
JPS4826368A JPS4826368A (enrdf_load_stackoverflow) 1973-04-06
JPS509383B2 true JPS509383B2 (enrdf_load_stackoverflow) 1975-04-12

Family

ID=13120415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5968971A Expired JPS509383B2 (enrdf_load_stackoverflow) 1971-08-07 1971-08-07

Country Status (1)

Country Link
JP (1) JPS509383B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52163478U (enrdf_load_stackoverflow) * 1976-06-05 1977-12-10
JP2022075319A (ja) * 2020-11-06 2022-05-18 三菱電機株式会社 半導体装置、ダイパッドおよび半導体装置の製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247252B2 (enrdf_load_stackoverflow) * 1972-09-25 1977-12-01
JPS555403B2 (enrdf_load_stackoverflow) * 1974-04-23 1980-02-06
JPS5153516A (ja) * 1974-11-06 1976-05-12 Kubota Ltd Garasusenikyokasementoseikeihinno seizohoho
JPS5227359A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Face down bonding method
JPS5278233A (en) * 1975-12-25 1977-07-01 Okura Industrial Co Ltd Production of inorganic* reinforced* lighttweight combined board by extrusion
JPS5278916A (en) * 1975-12-25 1977-07-02 Nippon Sheet Glass Co Ltd Method of molding glass fiber reinforced cement products
JPS53149762A (en) * 1977-06-02 1978-12-27 Hitachi Ltd Adhering method for thin plate
JPS5547765U (enrdf_load_stackoverflow) * 1978-09-21 1980-03-28
JPS5549520U (enrdf_load_stackoverflow) * 1978-09-26 1980-03-31
JPS58224711A (ja) * 1982-06-23 1983-12-27 住友金属工業株式会社 セメント積層板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52163478U (enrdf_load_stackoverflow) * 1976-06-05 1977-12-10
JP2022075319A (ja) * 2020-11-06 2022-05-18 三菱電機株式会社 半導体装置、ダイパッドおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JPS4826368A (enrdf_load_stackoverflow) 1973-04-06

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