JPS5549520U - - Google Patents

Info

Publication number
JPS5549520U
JPS5549520U JP13244978U JP13244978U JPS5549520U JP S5549520 U JPS5549520 U JP S5549520U JP 13244978 U JP13244978 U JP 13244978U JP 13244978 U JP13244978 U JP 13244978U JP S5549520 U JPS5549520 U JP S5549520U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13244978U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13244978U priority Critical patent/JPS5549520U/ja
Publication of JPS5549520U publication Critical patent/JPS5549520U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
JP13244978U 1978-09-26 1978-09-26 Pending JPS5549520U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13244978U JPS5549520U (enrdf_load_stackoverflow) 1978-09-26 1978-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13244978U JPS5549520U (enrdf_load_stackoverflow) 1978-09-26 1978-09-26

Publications (1)

Publication Number Publication Date
JPS5549520U true JPS5549520U (enrdf_load_stackoverflow) 1980-03-31

Family

ID=29099993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13244978U Pending JPS5549520U (enrdf_load_stackoverflow) 1978-09-26 1978-09-26

Country Status (1)

Country Link
JP (1) JPS5549520U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826368A (enrdf_load_stackoverflow) * 1971-08-07 1973-04-06
JPS5547765B2 (enrdf_load_stackoverflow) * 1975-10-28 1980-12-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826368A (enrdf_load_stackoverflow) * 1971-08-07 1973-04-06
JPS5547765B2 (enrdf_load_stackoverflow) * 1975-10-28 1980-12-02

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